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US 2001/0018800 A1Published application
Method for forming interconnects
OwnerGeorge Tzanavaras, Mihalis Michaelinventors
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Abstract
An embodiment of the present invention is a method for wafer level IC packaging that includes the steps of: (a) forming conductive bumps on metalized bond pads or conductors; and (b) surrounding the conductive bumps in a supporting layer.
Claims39
A method for forming interconnects comprises:
- forming an interconnect structure which includes steps of:
- forming conductive bumps on metalized bond pads or conductors;
- and
- then, at least partially surrounding the conductive bumps in a supporting layer.
1 more element
A method for forming interconnects comprises:
- cleaning vias formed on a wafer;
- filling vias and forming metalized bond pads;
- forming conductive bumps on the metalized bond pads;
- at least partially surrounding the conductive bumps in a supporting layer;
- delineating the conductive bumps;
- forming further conductive bumps over the conductive bumps;
- singulating integrated circuits from the wafer;
- and
- bonding the singulated integrated circuits to a printed circuit board.
6 more elements
A method for forming interconnects comprises:
- cleaning vias formed on a wafer;
- filling vias and forming metalized bond pads;
- forming conductive bumps on the metalized bond pads;
- at least partially surrounding the conductive bumps in a supporting layer;
- delineating the conductive bumps;
- forming further conductive bumps over the conductive bumps;
- singulating integrated circuits from the wafer;
- forming conductive bumps on a printed circuit board;
- at least partially surrounding the conductive bumps in a supporting layer;
- bonding the singulated integrated circuits to the printed circuit board.
7 more elements
A method of forming interconnects comprises:
- forming an interconnect structure that includes steps of:
- forming conductive bumps on metalized bond pads or conductors;
- enclosing the conductive bumps in a supporting layer;
- delineating the conductive bumps;
- and
- forming further conductive bumps over the conductive bumps.
3 more elements
A method of forming interconnects comprises:
- forming an interconnect structure on one or more of an integrated circuit and a printed circuit board, wherein forming the interconnect structure includes steps of:
- forming conductive bumps on metalized bond pads or conductors;
- enclosing the conductive bumps in a supporting layer;
- delineating the conductive bumps;
- and
- forming further conductive bumps over the conductive bumps of one or more of the interconnect structures.
3 more elements
Dependencies are inferred from the claim text.