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US 2001/0018796 A1Published application
Method of forming multilayer circuit structure
OwnerMichael G. Lee, Solomon Beilin +1inventors
InventorsMICHAEL G. LEE, SOLOMON BEILIN, WEN-CHOU WANG
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Abstract
A method for making a multilayer circuit structure using circuit substrates with apertures at edge regions is disclosed. The method includes using a roller element with teeth. The teeth are used to align the circuit substrates during a lamination process.
Claims20
A method for forming a multilayer circuit structure, the method comprising:
- aligning an aperture in a first circuit substrate and an aperture in a second circuit substrate, wherein the first circuit substrate is flexible;
- inserting a tooth from a roller element into the aligned apertures of the first and the second circuit substrates;
- rotating the roller element;
- and
- laminating the first circuit substrate to the second circuit substrate.
2 more elements
Dependencies are inferred from the claim text.