Back to results
US 2001/0018477 A1Published application
Adhesive composition
AssigneeSony Chemical Corporation
InventorHiroyuki Kumakura
Life of this patent
Estimating the term…
Abstract
An adhesive composition is obtained which has high reactivity and is able to connect even plastic substrates with high connection reliability. The adhesive composition is constituted of insulating resin, photopolymerization initiator, and oxetan compound.
Claims4
An adhesive composition, comprising:
- an insulating resin;
- a photopolymerization initiator;
- and
- an oxetan compound.
1 more element
Dependencies are inferred from the claim text.