Cleaning agent
AssigneeWako Pure Chemical Industries, Ltd.
InventorsMasahiko Kakizawa, Osamu Ichikawa, Ichiro Hayashida
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Abstract
Removing particles and metallic contaminants without corrosing the metallized wirings and without giving adverse effect of planarization on the semiconductor substrate surface can be effectively achieved by use of a cleaning agent which comprises an organic acid having at least one carboxyl group and a complexing agent having chelating ability.
Claims16
A cleaning agent for the semiconductor substrate surface, which comprises an organic acid having at least one carboxyl group and a complexing agent having chelating ability.
A cleaning method for the semiconductor substrate surface, which comprises treating the semiconductor substrate surface with a cleaning agent comprising an organic acid having at least one carboxyl group and a complexing agent having chelating ability.
Dependencies are inferred from the claim text.