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US 2001/0018261 A1Published application
Method and apparatus for filling a gap between spaced layers of a semiconductor
AssigneeMicron Technology, Inc.
InventorJ. Michael Brand
Life of this patent
Estimating the term…
Abstract
A semiconductor device assembly with a gap to be filled has thermal vias formed in the supporting substrate. After the semiconductor device is connected to the substrate and fill material positioned about the gap to create a seal, a vacuum is drawn through the thermal vias and a pressure applied to the fill material to urge the fill material into the interior of the gap.
Claims5
A method of manufacturing a semiconductor device assembly comprising:
- providing a semiconductor die having a first surface and a second active interior surface having electrical interconnection structure extending outwardly therefrom;
- providing a substrate having a metallized surface pattern of electrical circuits for contacting with said electrical interconnection structure of said semiconductor die, said substrate having an exterior surface spaced from said metallized surface pattern of electrical circuits and a plurality of vias extending through said metallized surface pattern of electrical circuits to said exterior surface;
- positioning said semiconductor die adjacent said substrate having said interconnection structure contacting a portion of the metallized surface pattern of electrical circuits of said substrate forming a gap having a perimeter;
- connecting a portion of said electrical interconnection structure of said semiconductor die to a portion of the metallized surface pattern of electrical circuits of said substrate forming an electrical circuit;
- placing fill material proximate the perimeter of said gap;
- providing a source of vacuum;
- and
- positioning the exterior surface of said substrate relative to said source of vacuum for drawing a vacuum through at least one of said plurality of vias and for urging said fill material from said perimeter into said gap.
5 more elements
A method of backfilling a flip-chip gap with fill material comprising:
- providing a flip chip semiconductor device assembly, said semiconductor device assembly including a flip chip semiconductor die having interconnection structure thereon mounted on a substrate defining a gap thereinbetween, said gap having a perimeter, said substrate having at least one via of a plurality of vias formed therein extending between said gap and an external surface of said substrate;
- providing a support for said flip chip semiconductor device assembly;
- providing a pressure chamber connected to said support;
- providing a source of pressure;
- connecting said source of pressure to said pressure chamber supplying a fluid under pressure thereto;
- providing a vacuum chamber connected to said support;
- providing a source of vacuum;
- connecting said source of vacuum to said vacuum chamber for drawing a vacuum therein;
- positioning a fill material about the perimeter of said gap;
- positioning said flip chip semiconductor device assembly having said fill material about the perimeter of said gap in said pressure chamber and with at least one via of said plurality of thermal vias extending into said vacuum chamber;
- operating said source of pressure for creating a pressure in said pressure chamber for urging said fill material into said gap;
- and
- operating said source of vacuum for drawing a vacuum in said vacuum chamber and in said gap through said at least one thermal via of said plurality of thermal vias for urging said fill material into said gap.
10 more elements
A method of backfilling a flip-chip gap with fill material comprising:
- providing a flip chip semiconductor device assembly, said semiconductor device assembly including a flip chip semiconductor die having interconnection structure thereon connected to a portion of a substrate for defining a gap having a perimeter, said substrate having at least one via of a plurality of vias formed therein for extending between said gap and an external surface of said substrate;
- providing a support for said flip chip semiconductor device assembly;
- providing a vacuum chamber connected to said support;
- providing a source of vacuum;
- connecting said source of vacuum to said vacuum chamber for drawing a vacuum;
- positioning a fill material about the perimeter of said gap;
- positioning said flip chip semiconductor device assembly having said fill material about the perimeter of said gap in communication with said vacuum chamber and with at least one via of said plurality of vias extending into said vacuum chamber;
- and
- operating said source of vacuum for drawing a vacuum in said vacuum chamber and in said gap through said at least one via of said plurality of vias for urging said fill material into said gap.
6 more elements
Dependencies are inferred from the claim text.