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US 2001/0018256 A1Published application
Method of patterning organic polymer film and method for fabricating semiconductor device
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsYoshihara Anda, Mitsuru Nishitsuji, Katsuhiko Kawashima, Tsuyoshi Tanaka
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Abstract
An organic polymer film patterning method includes the steps of: defining a resist film on a selected area of a substrate; depositing an organic polymer film over the substrate by a plasma CVD process so that the resist film is covered with part of the organic polymer film; and removing the resist film along with the part of the organic polymer film that has covered the resist film.
Claims15
A method of patterning a film of an organic polymer, comprising the steps of:
- defining a resist film on a selected area of a substrate;
- depositing an organic polymer film over the substrate by a plasma CVD process so that the resist film is covered with part of the organic polymer film;
- and
- removing the resist film along with the part of the organic polymer film that has covered the resist film.
1 more element
A method for fabricating a semiconductor device, comprising the steps of:
- defining a resist film on a selected area of a substrate;
- depositing an organic polymer film over the substrate by a plasma CVD process so that the resist film is covered with part of the organic polymer film;
- removing the resist film along with the part of the organic polymer film that has covered the resist film, thereby forming an opening in the organic polymer film;
- and
- forming a gate electrode on the selected area of the substrate that is exposed inside the opening of the organic polymer film.
2 more elements
Dependencies are inferred from the claim text.