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US 2001/0018236 A1Published application
Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby
AssigneeShellcase Ltd.
InventorAvner Pierre Badehi
Life of this patent
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Abstract
This invention discloses a crystalline substrate based device including a crystalline substrate having formed thereon a microstructure; and at least one packaging layer which is sealed over the microstructure by means of an adhesive and defines therewith at least one gap between the crystalline substrate and the at least one packaging layer. A method of producing a crystalline substrate based device is also disclosed.
Claims36
A crystalline substrate based device comprising:
- a crystalline substrate having formed thereon a microstructure;
- and
- at least one packaging layer which is sealed over said microstructure by means of an adhesive and defines therewith at least one gap between said crystalline substrate and said at least one packaging layer.
A chip scale packaged crystalline substrate comprising:
- a substrate having formed thereon a microstructure;
- and
- at least one chip scale package which is sealed over said microstructure and defines therewith at least one gap.
A method of producing a crystalline substrate based device comprising:
- providing a microstructure on a substrate;
- and
- adhesively sealing at least one packaging layer over said microstructure and at least partially spaced therefrom, thereby to define a gap between said microstructure and said at least one packaging layer.
Dependencies are inferred from the claim text.