Solder, solder paste and soldering method
AssigneeMatsushita Electic Industrial Co., Ltd.
InventorsAtsushi Yamaguchi, Tetsuo Fukushima, Kenichiro Suetsugu, Akio Furusawa
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Abstract
Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.
Claims6
A solder comprising 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest.
A solder comprising 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and further comprising at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn, along with Sn for the rest.
A solder paste comprising a flux composed of at least rosin, an activator, a thixotropic agent and a solvent, and a powder of a solder, characterized in that said solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest.
Dependencies are inferred from the claim text.