Electronic apparatus having a heat dissipation member
AssigneeFujitsu Limited
InventorsAkira Ueda, Masumi Suzuki, Minoru Hirano
Life of this patent
Estimating the term…
Abstract
The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.
Claims11
A heat dissipation structure for a notebook type computer, comprising:
- a heat reception member;
- a heat dissipation member coupled at a first position thereof to the heat reception member;
- and
- a cavity member connected to, and extending from the first position thereof and along a length of, the heat dissipation member, the cavity member being filled with a heat transfer liquid and sealed, and the heat transfer liquid transferring heat, coupled from the heat reception member, to and along the length of the heat dissipation member.
A heat dissipation structure in a housing of an electronic apparatus, the housing having spaced main surfaces extending in generally parallel, lateral directions and at least first and second sidewalls extending between the spaced main surfaces and together therewith defining an interior of the housing, the electronic apparatus having a heat producing element disposed at least in part within a first interior portion of the housing and, in operation, producing heat and discharging at least a part of the heat into the first interior portion of the housing, the heat dissipation structure comprising:
- a heat transfer member having a heat reception portion, disposed at least in part within the first interior portion of the housing and thermally coupled to the heat producing element to receive at least part of the heat produced and discharged thereby;
- and
- a heat dissipation member connected at a first position thereof to the heat transfer member and extending from the first position thereof to a remote end thereof and having a cavity member formed thereon and extending from the first position to the remote end thereof, the cavity member being filled with a heat transfer liquid and sealed and the heat transfer liquid transferring heat coupled to the first position of the heat dissipation portion, along the length of and to the remote end thereof.
A structure according to claim 8, wherein the heat dissipation member extends in parallel with, and adjacent to, one of the first and second sidewalls.
Dependencies are inferred from the claim text.