Mounting structure of semiconductor device and mounting method thereof
AssigneeNEC Corporation
InventorHirokazu Miyazaki
Life of this patent
Estimating the term…
Abstract
An insulating sheet which connects a semiconductor chip and a wiring substrate is provided between the semiconductor chip and the wiring substrate. The insulating sheet has windows therethrough at positions corresponding to those of connection pads of the wiring substrate and has leads, one end of each of the leads being fixed on the sheet and the other end of each of the leads protruding from the opposite surface of the sheet through a window. Each of solder balls of the semiconductor chip is connected to the fixed one end of one of the leads, and each of the connection pads is connected to the other end of each of the leads to electrically connect the semiconductor chip and the wiring substrate.
Claims16
A mounting structure of a semiconductor device comprising:
- a semiconductor chip which is provided with a plurality of solder balls;
- a wiring substrate which is provided with a plurality of connection pads;
- and
- an insulating sheet which has a plurality of leads and which is provided between said semiconductor chip and said wiring substrate,
- wherein said plurality of solder balls are electrically connected through said leads to corresponding ones of said connection pads, respectively
A mounting method of a semiconductor device for mounting a semiconductor chip provided with a plurality of solder balls on a wiring substrate provided with a plurality of connection pads, comprising:
- providing an insulating sheet having holes corresponding to said connection pads and having a plurality of leads, one end of each of said leads being fixed on a first surface of said insulating sheet and the other end of each of said leads protruding from a second surface of said insulating sheet through one of said holes;
- electrically connecting said other end of each of said leads of said insulating sheet to a corresponding one of said connection pads;
- and
- electrically connecting each of said solder balls to said fixed one end of a corresponding one of said leads.
An insulating sheet provided between a semiconductor chip and a wiring substrate comprising:
- a plurality of holes therethrough;
- and
- a plurality of leads, one end of each of said leads being fixed on a first surface of said insulating sheet and the other end of each of said leads being shaped to be afloat in said holes.
A method of manufacturing an insulating sheet provided between a semiconductor chip and a wiring substrate comprising:
- providing a metal film on one surface of said insulating sheet;
- masking and etching said metal film to form a plurality of leads;
- cutting out predetermined places of said insulating sheet to provide a plurality of holes through said insulating sheet;
- and
- making one end of each of said plurality of leads fall into a corresponding one of said holes.
A method of manufacturing an insulating sheet provided between a semiconductor chip and a wiring substrate comprising:
- cutting out predetermined places of said insulating sheet to provide a plurality of holes through said insulating sheet;
- fixing one end of each of a plurality of leads onto said insulating sheet;
- and
- making the other end of each of said leads fall into a corresponding one of said plurality of holes.
Dependencies are inferred from the claim text.