Push-up pin of a semiconductor element pushing-up device, a semiconductor element pushing-up device, and a method for separating a semiconductor element in a semiconductor element pushing-up device

A semiconductor element pushing-up device in a die bonding apparatus comprising:

• at least one push-up pin which includes a tip end portion having a shape for applying pushing-up pressure with the thicknesses of an adhesive sheet and adhesive kept constant when the pushing-up pressure for separating a semiconductor element which is attached to said adhesive sheet via said adhesive from said adhesive sheet by pushing up said semiconductor element from the rear surface side of said adhesive sheet is applied, and a base portion for supporting said tip end portion;
• a pin holder for supporting said push-up pin to be movable in a vertical direction;
• a backup holder for receiving said push-up pin and said pin holder and used as a vacuum chamber having at least one through hole formed in the upper surface thereof for passage of said push-up pin;
• a vacuum device for drawing said adhesive sheet to which said semiconductor element is attached via said adhesive onto the upper surface of said backup holder to provide vacuum in said backup holder;
• and
• a drive control device for driving said pin holder in a vertical direction.

A semiconductor element pushing-up device in a die bonding apparatus comprising:

• at least one push-up pin which includes a tip end portion having a shape for applying pushing-up pressure with the thicknesses of an adhesive sheet and adhesive kept constant when the pushing-up pressure for separating a semiconductor element which is attached to said adhesive sheet via said adhesive from said adhesive sheet by pushing up said semiconductor element from the rear surface side of said adhesive sheet is applied, and a base portion for supporting said tip end portion;
• a pin holder for supporting said push-up pin to be movable in a vertical direction;
• a backup holder for receiving said push-up pin and said pin holder and used as a vacuum chamber having at least one through hole formed in the upper surface thereof for passage of said push-up pin;
• a vacuum device connected to said backup holder, for drawing said adhesive sheet to which said semiconductor element is attached via said adhesive onto the upper surface of said backup holder to provide vacuum in said backup holder;
• drive control means for driving said pin holder in a vertical direction;
• means connected to said vacuum device, for measuring the vacuum suction pressure;
• and
• control means for controlling the operation of said push-up pin based on the result of measurement of said pressure measuring means.

A semiconductor element pushing-up device in a die bonding apparatus comprising:

• at least one push-up pin which includes a tip end portion having a shape for applying pushing-up pressure with the thicknesses of an adhesive sheet and adhesive kept constant when the pushing-up pressure for separating a semiconductor element which is attached to said adhesive sheet via said adhesive from said adhesive sheet by pushing up said semiconductor element from the rear surface side of said adhesive sheet is applied, and a base portion for supporting said tip end portion;
• a pin holder for supporting said push-up pin to be movable in a vertical direction;
• a backup holder for receiving said push-up pin and said pin holder and used as a vacuum chamber having at least one through hole formed in the upper surface thereof for passage of said push-up pin;
• a vacuum device connected to said backup holder, for drawing said adhesive sheet to which said semiconductor element is attached via said adhesive onto the upper surface of said backup holder to provide vacuum in said backup holder;
• means connected to said pin holder, for measuring a load applied to said push-up pin;
• and
• control means for controlling the operating condition of said push-up pin based on the result of measurement of said load measuring means.

A semiconductor element pushing-up device in a die bonding apparatus comprising:

• at least one push-up pin which includes a tip end portion having a shape for applying pushing-up pressure with the thicknesses of an adhesive sheet and adhesive kept constant when the pushing-up pressure for separating a semiconductor element which is attached to said adhesive sheet via said adhesive from said adhesive sheet by pushing up said semiconductor element from the rear surface side of said adhesive sheet is applied and said semiconductor element is taken up by suction of a semiconductor element suction head, and a base portion for supporting said tip end portion;
• a pin holder for supporting said push-up pin to be movable in a vertical direction;
• a backup holder for receiving said push-up pin and said pin holder and used as a vacuum chamber having at least one through hole formed in the upper surface thereof for passage of said push-up pin;
• a vacuum device connected to said backup holder, for drawing said adhesive sheet to which said semiconductor element is attached via said adhesive onto the upper surface of said backup holder to provide vacuum in said backup holder;
• means for applying a voltage between said element suction head and said push-up pin;
• means for measuring a current flowing between said element suction head and said push-up pin;
• and
• control means for controlling the operating condition of said push-up pin based on the result of measurement of said current measuring means.

A method for separating a semiconductor element in a semiconductor element pushing-up device of a die bonding apparatus comprising the steps of:

• fixedly holding an adhesive sheet to which semiconductor elements are attached by adhesive by vacuum suction in a vacuum condition;
• measuring vacuum suction pressure when the semiconductor element is pushed up from the rear surface side of the adhesive sheet by use of at least one push-up pin with the thicknesses of the adhesive sheet and the adhesive kept constant;
• and
• controlling the operating condition of the push-up pin based on the result of measurement.

A method for separating a semiconductor element in a semiconductor element pushing-up device of a die bonding apparatus comprising the steps of:

• fixedly holding an adhesive sheet to which the semiconductor element is attached by adhesive by vacuum suction in a vacuum condition;
• measuring a load applied to a push-up pin when the semiconductor element is pushed up from the rear surface side of the adhesive sheet by use of the pushup pin with the thicknesses of the adhesive sheet and the adhesive kept constant;
• and
• controlling the operating condition of the push-up pin based on the result of measurement of the load.

A method for separating a semiconductor element in a semiconductor element pushing-up device of a die bonding apparatus comprising the steps of:

• fixedly holding an adhesive sheet to which the semiconductor element is attached by adhesive by vacuum suction in a vacuum condition;
• applying a voltage between the element suction head and the push-up pin and measuring a current flowing between the element suction head and the pushup pin when the semiconductor element attached to the adhesive sheet by adhesive is pushed up from the rear surface side of the adhesive sheet by use of the pushup pin with the thicknesses of the adhesive sheet and the adhesive kept constant, separated from the adhesive sheet and then taken up by suction of the semiconductor element suction head;
• and
• controlling the operating condition of the push-up pin based on the result of measurement.