Wiring boards, semiconductor devices and their production processes

A process for the production of a wiring board comprising a substrate having applied on the same side surface thereof one or more terminals for connecting a semiconductor element and one or more terminals for external connection, in which said terminals for connecting the semiconductor element and said terminals for external connection are electrically connected, by a wire, with each other, which process comprises the steps of:

• forming terminals for connecting the semiconductor element and said terminals for external connection in predetermined sites on the same side surface of a base body;
• electrically connecting said terminals for connecting the semiconductor element and said terminals for external connection through wires;
• applying a resinous material to said surface of said base body at a predetermined thickness to form a wiring board precursor comprising said base body having resin-encapsulated thereon said terminals for connecting the semiconductor element, said terminals for external connection and said wires;
• and
• separating the wiring board from the base body of said wiring board precursor.

A process for the production of a wiring board comprising a substrate having applied on the same side surface thereof one or more terminals for connecting a semiconductor element and one or more terminals for external connection, in which said terminals for connecting the semiconductor element and said terminals for external connection are electrically connected, by a wire, with each other in an interior of the wiring board, which process comprises the steps of:

• providing, on predetermined sites of a base body, rods made of an electrically conductive metal and passed through said base body to form said terminals for connecting the semiconductor element and said terminals for external connection, said terminals being defined by one end surface of said rods which is exposing at one surface of said base body;
• electrically connecting said terminals for connecting the semiconductor element and said terminals for external connection through wires;
• and
• applying a resinous material to said one surface of said base body at a predetermined thickness to form a wiring board having resin-encapsulated therein said terminals for connecting the semiconductor element, said terminals for external connection and said wires.

A process for the production of a semiconductor device comprising a wiring board and one or more semiconductor elements packaged on predetermined sites of said wiring board, which process comprises the steps of:

• forming terminals for connecting the semiconductor element and terminals for external connection in predetermined sites on the same side surface of a base body;
• electrically connecting said terminals for connecting the semiconductor element and said terminals for external connection through wires;
• applying a resinous material to said surface of the base body at a predetermined thickness to form a wiring board precursor comprising said base body having resin-encapsulated thereon said terminals for connecting the semiconductor element, said terminals for external connection and said wires;
• separating the wiring board from the base body of said wiring board precursor;
• and
• packaging and electrically connecting said semiconductor elements onto said terminals for connecting the semiconductor element of said wiring board.