Tool position measurement method, offset measurement method, reference member and bonding apparatus

An offset measurement method used in a processing apparatus that comprises:

• a position detection imaging device that images an object to be processed, and
• a tool which is installed in an offset fashion with respect to said position detection imaging device and performs a processing operation on said object to be processed, wherein
• said offset measurement method comprises:
• a step in which said positional relationship between said position detection imaging device and said reference member disposed in a fixed position is measured by said position detection imaging device in a first attitude in which said position detection imaging device is caused to face said reference member,
• a step in which said positional relationship between said tool and said reference member is measured by causing said tool to approach said reference member and detecting said contact between said tool and said reference member in a second attitude in which said tool is caused to face said reference member, and
• a step in which an offset amount between said position detection imaging device and said tool is determined based upon said measurement results and amounts of movement of said position detection imaging device and said tool between said first attitude and second attitude.

A bonding apparatus comprises:

• a position detection imaging device that images an object to be bonded, and
• a tool which is installed so as to be offset with respect to said position detection imaging device and processes said object to be bonded,
• wherein said bonding apparatus is further provided with an operation control device which determines an offset amount between said position detection imaging device and said tool based upon:
• a measured value that is obtained when a positional relationship between said position detection imaging device and a reference member disposed in a fixed position is measured by said position detection imaging device in a first attitude in which said position detection imaging device is caused to approach said reference member,
• a measured value that is obtained when a positional relationship between said tool and said reference member is measured by detecting said contact between said tool and said reference member in a second attitude in which said tool is caused to approach said reference member, and
• amounts of movement of said position detection imaging device and said tool between said first attitude and second attitude.

A bonding apparatus comprises:

• a position detection imaging device that images an object to be bonded,
• a tool which is installed so as to be offset with respect to said position detection imaging device and processes said object to be bonded,
• an XY table which moves said position detection imaging device and said tool as an integral unit, and
• a detection means which detects a contact between said tool and said object to be bonded based upon variations in ultrasonic vibrations applied to said tool,
• wherein said bonding apparatus is provided with an operation control device which determines an offset amount between said position detection imaging device and said tool based upon:
• a measured value that is obtained when said positional relationship between said position detection imaging device and a reference member disposed in a fixed position is measured by said position detection imaging device in a first attitude in which said position detection imaging device is caused to approach said reference member by said XY table,
• a measured value that is obtained when said positional relationship between said tool and said reference member is measured as a result of said contact between said tool and said reference member being detected by said detection means on said basis of variations in said ultrasonic vibrations applied to said tool in a second attitude in which said tool is caused to approach said reference member by said XY table, and
• an amount of movement of said XY table between said first attitude and second attitude.