Thick-film etch-back process for use in manufacturing fine-line hybrid circuits
OwnerRobin L. Miller, Phung Dac Nguyeninventors
Life of this patent
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Abstract
A method for making thick-film conductor line patterns having conductor linewidths and spacings which are each less than about 5 mils. The method is especially useful in manufacturing fine-line hybrid circuits. The method involves forming a conductor line circuit pattern of thick-film material on a principle surface of a substrate. The principle surface of the substrate is masked so that selected portions of the conductor line circuit pattern are exposed. The exposed portions of the pattern are then removed from the substrate to reduce the conductor linewidths and spacings of the pattern to less than about 5 mils.
Claims13
A method for making thick-film conductor line patterns having conductor linewidths and spacings which are each less than about 5 mils, the method comprising the steps of:
- forming a conductor line pattern of thick-film material on a principle surface of a substrate;
- masking the principle surface of the substrate so that selected portions of the conductor line pattern are exposed;
- and
- removing the exposed portions of the conductor line pattern from the substrate to reduce the conductor linewidths and spacings of the pattern to less than about 5 mils.
A method for making a hybrid circuit, the method comprising the steps of:
- forming a conductor line circuit pattern of thick-film material on a principle surface of a substrate;
- masking the principle surface of the substrate so that selected portions of the conductor line circuit pattern are exposed;
- removing the exposed portions of the conductor line circuit pattern from the substrate to reduce the conductor linewidths and spacings of the pattern to less than about 5 mils;
- bonding at least two active devices to the substrate, the conductor line circuit pattern electrically interconnecting the active devices.
Dependencies are inferred from the claim text.