Method of partially plating substrate for electronic devices
AssigneeNippon Steel Corporation
InventorsKOHEI TATSUMI, KENJI SHIMOKAWA, EIJI HASHINO
Life of this patent
Estimating the term…
Abstract
The object of the present invention is to provide a free and precise control of the plating amount while easily determining a selected portion to be plated. Small balls 24 are arranged at, and adhered or bonded to, via holes 22 of a TAB tape 21 and the small balls 24 are then melted so that a copper wiring 23 exposed at the via holes 22 of the TAB tape 21 can be selectively plated with a different metal to enable selected portions of a substrate for electronic devices to be partially plated easily and precisely.
Claims9
A method of partially plating a substrate for electronic devices, comprising arranging small balls at selected portions of a substrate for mounting semiconductor devices thereon, or a substrate for mounting electronic devices thereon and including a lead frame, and adhering or bonding the small balls thereto, and melting the small balls, thereby selectively plating the selected portions of the substrate for electronic devices with a different metal.
Dependencies are inferred from the claim text.