Method of testing semiconductor integrated circuits and testing board for use therein
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsYoshiro Nakata, Shinchi Oki
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Abstract
A method of testing semiconductor integrated circuits comprises the step of simultaneously testing a plurality of semiconductor integrated circuit elements for electric characteristics by applying a voltage to the respective testing electrodes of the semiconductor integrated circuit elements. The simultaneous testing step includes the step of applying the voltage to the respective testing electrodes of the semiconductor integrated circuit elements via PTC elements provided for the semiconductor integrated circuit elements in a one-to-one relationship.
Claims3
A method of testing semiconductor integrated circuits, comprising the steps of:
- simultaneously testing a plurality of semiconductor integrated circuit elements for electric characteristics by applying a voltage to respective testing electrodes of said semiconductor integrated circuit elements,
- said step including the step of applying the voltage to the respective testing electrodes of the semiconductor integrated circuit elements via at least one PTC element;
- and
- wherein said step includes the step of applying the voltage to the respective testing electrodes of said semiconductor integrated circuit elements via the plurality of PTC elements provided in a one-to-one relationship for individual blocks formed by dividing said semiconductor integrated circuit elements into groups.
A method of testing semiconductor integrated circuits, comprising the steps of:
- simultaneously testing a plurality of semiconductor integrated circuit elements for electric characteristics by applying a voltage to respective testing electrodes of said semiconductor integrated circuit elements, said step including the step of applying the voltage to the respective testing electrodes of the semiconductor integrated circuit elements via at least one PTC element;
- wherein said plurality of semiconductor integrated circuit elements are mounted on a burn-in board and said step includes the step of performing a simultaneous burn-in process with respect to said semiconductor integrated circuit elements.
A testing board for simultaneously testing a plurality of semiconductor integrated circuit elements for electric characteristics by applying a voltage to respective testing electrodes of said semiconductor integrated circuit elements, said testing board comprising:
- a plurality of connection terminals provided on a substrate to be connected to the respective testing electrodes of said semiconductor integrated circuit elements;
- a voltage supply line provided in said substrate to supply the voltage to said connection terminals;
- and
- at least one PTC element provided on said substrate to be interposed between said voltage supply line and at least one of said connection terminals;
- wherein said connection terminals are probe terminals positioned on said substrate to correspond to the respective testing electrodes of said semiconductor integrated circuit elements;
- said testing board is a probe card for simultaneously testing the electric characteristics of said semiconductor integrated circuit elements formed in a semiconductor wafer;
- and
- said voltage supply line is a common voltage supply line connected in common to said plurality of probe terminals, said probe terminals and said voltage supply line are provided on one side of said substrate, and said plurality of PTC elements are provided on peripheral portions of one side of said substrate to correspond to individual blocks formed by dividing said probe terminals into groups in a one-to-one relationship.
Dependencies are inferred from the claim text.