Structure of polishing head of polishing apparatus
AssigneeTokyo Seimitsu Co., Ltd.
InventorMinoru Numoto
Life of this patent
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Abstract
A polishing head of a polishing apparatus of this invention has a structure in which an air blast port is formed in a lower surface of a carrier 20, and an upper outer peripheral portion 24 of the carrier is so formed as to protrude in a diametric direction, and is placed on a retainer ring 30 to thereby form a seal portion 25. The retainer ring clamps a peripheral edge of a rubber sheet in such a form as to cover the carrier. Consequently, an air chamber 61 is formed between the carrier lower surface and the rubber sheet, and an air pressure of this air chamber pushes a wafer W to a polishing cloth 2.
Claims7
A structure of a polishing head of a polishing apparatus for pushing a work to a polishing pad on a polishing table and causing relative movement of said work, said polishing head including:
- head main body allowed to rotate, and so disposed as to oppose said polishing table;
- a carrier idly supported by said head main body in such a manner as to be capable of moving in a vertical direction;
- a retainer ring idly supported by said head main body in such a manner as to be capable of moving in a vertical direction, encompassing said work and coming into contact with said polishing pad during polishing;
- and
- a flexible sheet supported at peripheral edge thereof by said retainer ring in such a manner as to cover the inside of said retainer ring;
- wherein an outer peripheral edge portion of said carrier protruding in a diametric direction is placed on said retainer ring to form a seal portion of air, and air from an air blast port formed on a lower surface of said carrier inflates said flexible sheet and pushes said work to said polishing pad during polishing.
Dependencies are inferred from the claim text.