Semiconductor device and method of manufacturing the same
AssigneeNEC Corporation
InventorTakashi Miyazaki
Life of this patent
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Abstract
A semiconductor device includes a passivation film (19) having opening portions through which an electrode pads (18) formed on a semiconductor chip (21) are exposed, projecting electrode portions (20) whose one end faces are connected to the electrode pads (18) through the opening portions, post electrode portions (16A) through which the other end faces of the projecting electrode portions (20) and the metal bumps (26) are connected to each other, and an insulating resin layer (13) having elasticity which covers the post electrode portions (16A), the projecting electrode portions (20) and the passivation film (19) with the exception of the end faces of the post electrode portions (16A).
Claims23
A semiconductor device, comprising:
- a semiconductor chip;
- electrode pads formed on said semiconductor chip;
- metal bumps connected to said electrode pads;
- a passivation film which is formed in said semiconductor chip and has opening portions through which said electrode pads are exposed;
- first conductive members whose one end faces are connected to said electrode pads through said opening portions;
- second conductive members through which the other end faces of said first conductive members and said metal bumps are connected to one another;
- and
- an insulating resin layer having elasticity which covers said first conductive members, said second conductive members and said passivation film with the exception of the end faces of said second conductive members.
A method of manufacturing a semiconductor device having a semiconductor chip, electrode pads formed on the semiconductor chip, and metal bumps connected to the electrode pads, comprising the steps of:
- forming on the surface of a metal plate a resist film which is subjected to a patterning treatment for preparing a pattern corresponding to the pattern of the electrode pads of the semiconductor chip;
- selectively etching the metal plate with the resist film used as a mask to achieve a temporary board having plural metal posts projecting from a bottom portion thereof;
- connecting first conductive members formed on the electrode pads to the metal posts of the temporary board;
- disposing an insulating resin layer having elasticity between the semiconductor chip and the temporary board;
- removing the bottom portion of the temporary board to convert the metal posts into second conductive members whose end faces are exposed from the insulating resin layer;
- and
- mounting the metal bumps on the exposed end faces of the second conductive members.
A method of manufacturing a semiconductor device having a semiconductor chip, electrode pads formed on the semiconductor chip, and metal bumps connected to the electrode pads, comprising the steps of:
- forming on the surface of a metal plate a resist film which is subjected to a patterning treatment for preparing a pattern corresponding to the pattern of the electrode pads of the semiconductor chip;
- conducting a plating treatment on the metal plate after the formation of the resist film to form plural metal posts on the metal plate, thereby forming a temporary board;
- connecting first conductive members formed on the electrode pads of the semiconductor chip to the metal posts;
- disposing an insulating resin layer having elasticity between the semiconductor chip and the temporary board;
- removing the metal plate of the temporary board to convert the metal posts into second conductive members whose end faces are exposed from the insulating resin layer;
- and
- mounting the metal bumps on the exposed end faces of the second conductive members.
Dependencies are inferred from the claim text.