Semiconductor inspection apparatus and inspection method using the apparatus
AssigneeFujitsu Limited
InventorsNorio Fukasawa, Yukinori Sumi
Life of this patent
Estimating the term…
Abstract
A semiconductor inspection apparatus performs a test on a to-be-inspected device which has a spherical connection terminal. This apparatus includes a conductor layer formed on a supporting film. The conductor layer has a connection portion. The spherical connection terminal is connected to said connection portion. At least a shape of said connection portion is changeable. The apparatus further includes a shock absorbing member, made of an elastically deformable and insulating material, for at least supporting said connection portion.
Claims30
A semiconductor inspection apparatus for performing a test on a to-be-inspected device which has a spherical connection terminal, said apparatus comprising:
- a conductor layer formed on a supporting film, said conductor layer having a connection portion, said spherical connection terminal is connected to said connection portion, at least a shape of said connection portion being changeable;
- and
- a shock absorbing member, made of an elastically deformable and insulating material, for at least supporting said connection portion.
An inspection method using a semiconductor inspection apparatus for performing a test on a to-be-inspected device which has a spherical connection terminal, said apparatus comprising:
- a conductor layer formed on a supporting film, said conductor layer having a connection portion, said spherical connection terminal is connected to said connection portion, at least a shape of said connection portion being changeable;
- and
- a shock absorbing member, made of an elastically deformable and insulating material, for at least supporting said connection portion,
- said inspection method comprising the step of pressing said spherical connection terminal to said connection portion formed in said conductor layer so that elastic deformation occurs in said connection portion of said conductor layer and said shock absorbing member,
- the elastic restoring force occurring in said connection portion and said shock absorbing member due to said elastic deformation causing said connection portion to be pressed to said spherical connection terminal so that electrical connection therebetween is provided.
An inspection method using a semiconductor inspection apparatus for performing a test on a to-be-inspected device which has a spherical connection terminal, said apparatus comprising:
- a conductor layer formed on a supporting film, said conductor layer having a connection portion, said spherical connection terminal is connected to said connection portion, at least a shape of said connection portion being changeable;
- a shock absorbing member, made of an elastically deformable and insulating material, for at least supporting said connection portion;
- and
- a positioning mechanism for performing positioning between said to-be-inspected device having said spherical connection terminal and said connection portion,
- said positioning mechanism comprising a positioning substrate, said positioning substrate being located so as to face said to-be-inspected device which is loaded on said conductor layer, said positioning substrate having a hole which has a shape corresponding to said spherical connection terminal,
- said inspection method comprising the steps of:
- a) inserting said spherical connection terminal into said hole of said positioning substrate, and thus positioning said spherical connection terminal;
- b) causing said spherical connection terminal to be electrically connected with said connection terminal while maintaining the condition where the positioning has been performed;
- and
- c) performing a test of said to-be-inspected device.
An inspection method using a semiconductor inspection apparatus for performing a test on a to-be-inspected device which has a spherical connection terminal, said apparatus comprises:
- a conductor layer formed on a supporting film, said conductor layer having a connection portion, said spherical connection terminal is connected to said connection portion, at least a shape of said connection portion being changeable;
- a shock absorbing member, made of an elastically deformable and insulating material, for at least supporting said connection portion;
- and
- a positioning mechanism for performing positioning between said to-be-inspected device having said spherical connection terminal and said connection portion,
- said positioning mechanism comprising a positioning substrate, said positioning substrate being located so as to face said to-be-inspected device which is loaded on said conductor layer, said positioning substrate having a hole which has a shape corresponding to said spherical connection terminal,
- said inspection method comprising the step of vibrating at least one of said positioning substrate and said to-be-inspected device and thus positioning said spherical connection terminal in said hole of said positioning substrate.
An inspection method using a semiconductor inspection apparatus for performing a test on a to-be-inspected device which has a spherical connection terminal, said apparatus comprises:
- a conductor layer formed on a supporting film, said conductor layer having a connection portion, said spherical connection terminal is connected to said connection portion, at least a shape of said connection portion being changeable;
- a shock absorbing member, made of an elastically deformable and insulating material, for at least supporting said connection portion;
- and
- a positioning mechanism for performing positioning between said to-be-inspected device having said spherical connection terminal and said connection portion,
- said positioning mechanism comprising a positioning substrate, said positioning substrate being located so as to face said to-be-inspected device which is loaded on said conductor layer, said positioning substrate having a hole which has a shape corresponding to said spherical connection terminal,
- said positioning substrate having a drawing mechanism for drawing said spherical connection terminal,
- said inspection method comprising the steps of:
- a) forming a suction path in said positioning substrate and connecting a suction apparatus to said suction path, and
- b) positioning said spherical connection terminal in said hole of said positioning substrate as a result of said spherical connection terminal being drawn to said suction path.
An inspection method using a semiconductor inspection apparatus for performing a test on a to-be-inspected device which has a spherical connection terminal, said apparatus comprises:
- a conductor layer formed on a supporting film, said conductor layer having a connection portion, said spherical connection terminal is connected to said connection portion, at least a shape of said connection portion being changeable;
- a shock absorbing member, made of an elastically deformable and insulating material, for at least supporting said connection portion,
- a positioning mechanism for performing positioning between said to-be-inspected device having said spherical connection terminal and said connection portion is provided,
- said positioning mechanism comprising a positioning substrate, said positioning substrate being located so as to face said to-be-inspected device which is loaded on said conductor layer, said positioning substrate having a hole which has a shape corresponding to said spherical connection terminal,
- said positioning substrate having a drawing mechanism for drawing said spherical connection terminal,
- said inspection method comprising the steps of:
- a) forming said positioning substrate of a porous material and connecting a suction apparatus to said positioning substrate;
- and
- b) positioning said spherical connection terminal in said hole of said positioning substrate as a result of said spherical connection terminal being drawn to said positioning substrate.
Dependencies are inferred from the claim text.