A method of fabricating a thermal infrared detector, said thermal infrared detector comprising:
- an infrared photosensitive area that is provided with an infrared ray absorbing part that absorbs infrared light, a thermal detector that detects temperature change of said infrared ray absorbing part, and electrodes that are electrically connected to said thermal detector;
- a substrate provided with contact pads that are electrically connected to said electrodes;
- an infrared ray reflecting film that is formed on the surface of said substrate on which said contact pads are present;
- a first dielectric protective film that is formed on the surface of said infrared ray reflecting film so as to cover said infrared ray reflecting film;
- supports for holding said infrared photosensitive area above said first dielectric protective film that are composed of wiring material that electrically connects said electrodes to said contact pads and a second dielectric protective film that covers said wiring material;
- and
- a shield that projects from portions of said infrared ray absorbing part other than portions corresponding to said electrodes, that covers the surfaces of said electrodes and said supports that are directed away from said substrate with an interposed space between said shield and both of said electrodes and said supports, and that further covers said contact pads of said substrate with an interposed space;
- said method of fabricating said thermal infrared detector comprising steps of:
- preparing said substrate having said contact pads;
- forming said infrared ray reflecting film on the surface of said substrate on which said contact pads are present at portions that correspond to said infrared photosensitive area;
- forming said first dielectric protective film on the surfaces of each of said infrared ray reflecting film and said substrate so as to cover said infrared ray reflecting film;
- forming a first sacrificial layer on the surface of said substrate on which said contact pads are present at portions corresponding to said infrared photosensitive area for forming a space between said substrate and said infrared photosensitive area;
- forming a first material film on the surfaces of each of said first sacrificial layer and said first dielectric protective film so as to cover said first sacrificial layer;
- forming said thermal detector on the surface of said first material film at portions corresponding to said first sacrificial layer;
- forming a second material film on the surfaces of each of said thermal detector and said first material film so as to cover said thermal detector;
- forming first openings at portions corresponding to said contact pads on each of said first dielectric protective film and said first and second material films;
- forming second openings so as to expose said thermal detector at portions corresponding to said electrodes on portions of said second material film that overlie said thermal detector;
- forming a metal film inside said first and second openings as well as on the surface of said second material film;
- patterning said metal film so as to expose said second material film and forming said electrodes of said infrared photosensitive area and wiring material of said supports;
- forming a third material film on the surfaces of said metal film and said second material film so as to cover said metal film;
- patterning said first to third material films so as to expose said first sacrificial layer, and forming said infrared ray absorbing part that is constituted by portions of each of said first to third material films and said second dielectric protective film that is constituted by other portions of each of said first to third material films;
- forming a second sacrificial layer on the surface of said third material film and exposed surfaces of said first sacrificial layer for forming a space between said shield and said electrodes of said infrared photosensitive area, a space between said shield and said supports, and a space between said shield and said contact pads of said substrate;
- patterning said second sacrificial layer so as to expose part of portions of said third material film that correspond to said thermal detector;
- forming a fourth material film on the surface of said second sacrificial layer and on exposed surfaces of said third material film;
- patterning said fourth material film so as to expose a portion of said second sacrificial layer and forming said shield that is constituted by a portion of said fourth material film;
- and
- removing said first and second sacrificial layers.