Method of checking wirebond condition
AssigneeRohm Co., Ltd.
InventorKazuya Ikoma
Life of this patent
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Abstract
A method of checking a wirebond condition is provided, wherein the wirebond condition results from the bonding of a conductive wire to an object such as a semiconductor chip and a lead. The wire is guided by a bonding tool. According to the checking method, first, a first position of the bonding tool is detected when the bonding of the wire is completed. Then, a pulling force, which is small enough to prevent breakage of the wire, is applied to the wire. In this state, a second position of the bonding tool is detected. Finally, the first and the second positions of the bonding tool are compared with each other.
Claims8
A method of checking a wirebond condition produced by bonding a conductive wire to an object, the wire being guided by a bonding tool, the method comprising the steps of:
- detecting a first position of the bonding tool when the bonding of the wire is completed;
- applying a pulling force to the wire, the pulling force being small enough to prevent breakage of the wire;
- detecting a second position of the bonding tool while the pulling force is being applied to the wire;
- and
- comparing the first and the second positions of the bonding tool with each other.
A method of checking a wirebond condition produced by bonding a conductive wire to an object, the method comprising the steps of:
- detecting a first position of the object when the wire is brought into contact with the object;
- detecting a second position of the object when the bonding of the wire is completed;
- calculating a difference between the first and the second positions of the object;
- and
- comparing the calculated difference with a predetermined value.
Dependencies are inferred from the claim text.