Methods for using a support backer board system for siding
AssigneePactiv Corporation
InventorsJohn W. Lubker II, Gregg A. Hebert
Life of this patent
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Abstract
A method for using a support backer board system and siding. The support backer board system comprises at least a first layer. The first layer is made from a material selected from the group consisting of alkenyl aromatic polymers, polyolefins, polyethylene terephthalate, polyesters, and combinations thereof. The board system is thermoformed into a desired shape with the desired shape being generally contour to the selected siding. The siding is attached to the board system so as to provide support thereto. In one process, the siding may be vinyl.
Claims20
A method for using a support backer board system and siding, said support backer board system comprising at least a first layer, the method comprising the steps of:
- providing siding;
- extruding a first layer, said first layer being made from a material selected from the group consisting of alkenyl aromatic polymers, polyolefins, polyethylene terephthalate, polyesters, and combinations thereof;
- thermoforming said board system into a desired shape, said desired shape being generally contour to said selected siding;
- and
- attaching said siding to said board system so as to provide support thereto.
A method for using a support backer board system and siding, said support backer board system comprising at least a first layer, the method comprising the steps of:
- providing siding;
- extruding a first layer, said first layer being made from at least one alkenyl aromatic polymer;
- thermoforming said board system into a desired shape, said desired shape being generally contour to said selected siding;
- and
- attaching said siding to said board system so as to provide support thereto.
Dependencies are inferred from the claim text.