# US 12,772,391 B2 · Insulation structure and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,772,391 B2 - Document ID: US12772391B2 - Status: Granted - Kind: B2 - Application number: 18/625,247 - Filed: 2024-04-03 - Published: 2025-02-06 - Granted: 2026-10-20 - Earliest claimed: 2023-08-04 - Assignees: Delta Electronics (Shanghai) Co., Ltd. - Applicants: Delta Electronics (Shanghai) Co., Ltd. - Inventors: Jianxing Dong; Lei Chen; Teng Liu; Xiaohu Li - Web page: https://patentgrep.com/patent/US12772391B2 ## CPC - H05K 5/0209: {Thermal insulation, e.g. for fire protection or for fire containment or for high temperature environments} - H05K 3/107: {by filling grooves in the support with conductive material (H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence)} - H05K 9/0007: {Casings (standardised racks H05K9/0062)} - H05K 2201/09036: Recesses or grooves in insulating substrate - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract The present application provides an insulation structure and an electronic device, where the insulation structure includes a first substrate, a first conductive body, and a first groove, the first substrate includes a first surface and a second surface oppositely disposed; the first conductive body is disposed on the first surface or second surface; the first groove is located on a same surface as the first conductive body and adjacent to the first conductive body; a surface of the first groove is provided with a first conductive layer, and the first conductive layer is electrically connected with the first conductive body. The insulation structure of the present application slows down the trend of potential line changes at the end of the first conductive body, reduces the electric field strength here, and improves the reliability of insulation. ## Claims ### Claim 1 An insulation structure, comprising: a first substrate, wherein the first substrate comprises a first surface and a second surface oppositely disposed; a first conductive body, wherein the first conductive body is disposed on the first surface; a first groove disposed on the first surface of the first substrate, wherein an opening of the first groove is located on the first surface, a preset thickness is reserved between a bottom wall of the first groove and the second surface, and the first groove is adjacent to the first conductive body; wherein a surface of the first groove is provided with a first conductive layer, and the first conductive layer is electrically connected with the first conductive body. ### Claim 2 (depends on 1) The insulation structure according to claim 1, wherein the first substrate is further provided with a first connecting layer, and the first conductive body is connected with the first conductive layer through the first connecting layer. ### Claim 3 (depends on 2) The insulation structure according to claim 2, wherein the first connecting layer is a part of the first conductive layer, wherein the first conductive layer is electrically connected with the first conductive body after extending beyond the first groove. ### Claim 4 (depends on 1) The insulation structure according to claim 1, wherein the insulation structure further comprises a second conductive body and a second groove, wherein the first conductive body, the first groove, the second conductive body, and the second groove are all located on a same surface, and the second groove is adjacent to the second conductive body; a surface of the second groove is provided with a second conductive layer, and the second conductive layer is electrically connected with the second conductive body; and a potential of the first conductive body is different from a potential of the second conductive body. ### Claim 5 (depends on 1) The insulation structure according to claim 1, wherein the insulation structure further comprises a second conductive body, the second conductive body is adjacent to the first substrate, and a potential of the first conductive body is different from a potential of the second conductive body. ### Claim 6 (depends on 1) The insulation structure according to claim 1, wherein the insulation structure further comprises a second conductive body and a second groove, wherein the second conductive body and the second groove are disposed on the second surface, and the second groove is adjacent to the second conductive body; a surface of the second groove is provided with a second conductive layer, the second conductive layer is electrically connected with the second conductive body; and a potential of the first conductive body is different from a potential of the second conductive body. ### Claim 7 (depends on 6) The insulation structure according to claim 6, wherein the insulation structure further comprises a heat sink, and the heat sink is disposed on the second surface. ### Claim 8 (depends on 1) The insulation structure according to claim 1, wherein the insulation structure further comprises a second conductive body and a heat sink, wherein the second conductive body is disposed on the second surface, and a potential of the first conductive body is different from a potential of the second conductive body; and the heat sink is disposed on the second surface, and a projection of the first conductive body on the first surface is within a projection range of the second conductive body or the heat sink on the first surface. ### Claim 9 (depends on 1) The insulation structure according to claim 1, wherein there are multiple first conductive bodies, and the multiple first conductive bodies are connected in series or parallel, wherein the first groove is adjacent to an outer side of an outermost first conductive body. ### Claim 10 (depends on 1) The insulation structure according to claim 1, wherein the insulation structure further comprises: a second substrate, wherein the second substrate comprises a third surface and a fourth surface oppositely disposed; a second conductive body, wherein the second conductive body is disposed on the third surface or the fourth surface; a second groove, wherein the second groove is located on a same surface as the second conductive body and adjacent to the second conductive body; wherein a potential of the first conductive body is different from a potential of the second conductive body; a surface of the second groove is provided with a second conductive layer, and the second conductive layer is electrically connected with the second conductive body. ### Claim 11 (depends on 10) The insulation structure according to claim 10, wherein the second substrate is further provided with a second connecting layer, and the second conductive body is connected to the second conductive layer through the second connecting layer. ### Claim 12 (depends on 11) The insulation structure according to claim 11, wherein the second connecting layer is a part of the second conductive layer, wherein the second conductive layer is electrically connected with the second conductive body after extending beyond the second groove. ### Claim 13 (depends on 1) The insulation structure according to claim 1, wherein the first groove further comprises a side wall. ### Claim 14 (depends on 13) The insulation structure according to claim 13, wherein the first conductive layer located on the side wall and the first conductive layer located on the bottom wall have a same thickness. ### Claim 15 (depends on 13) The insulation structure according to claim 13, wherein the side wall is perpendicular to the bottom wall; or, the side wall and the bottom wall are connected through an arc transition segment; or, the bottom wall and side walls on both sides of the bottom wall jointly form an arc shape within a cross-section perpendicular to the first substrate. ### Claim 16 (depends on 13) The insulation structure according to claim 13, wherein a shielding structure is provided in the first groove. ### Claim 17 (depends on 16) The insulation structure according to claim 16, wherein the shielding structure is a wire, wherein the wire is connected with the first conductive layer at a side wall away from the first conductive body, wherein a side of the wire away from the bottom wall is higher than the first surface; or, the shielding structure is a conductive protrusion, wherein the conductive protrusion is located on the first conductive layer on a surface of the bottom wall, wherein the conductive protrusion extends in a direction away from the bottom wall, and a side of the conductive protrusion away from the bottom wall is higher than the first surface; or, the shielding structure is a conductive shielding cover, wherein the conductive shielding cover comprises a main body and a bending part, with the main body being parallel to the first surface and covering the opening of the first groove partly, a first end of the main body being electrically connected with the first conductive body or the first conductive layer, a second end of the main body being connected with the bending part, and the bending part being bent towards the first groove, wherein the main body is disposed higher than the first surface. ### Claim 18 (depends on 1) The insulation structure according to claim 1, wherein the first groove is separated from the first conductive body by a preset distance, wherein the preset distance ranges from 0 mm to 0.3 mm. ### Claim 19 (depends on 1) The insulation structure according to claim 1, wherein the first conductive layer is a metal layer or a semi-conductive layer. ### Claim 20 (depends on 1) The insulation structure according to claim 1, wherein the first substrate is a solid-state insulation board, wherein the solid-state insulation board is a printed circuit board or a ceramic board. ### Claim 21 (depends on 1) The insulation structure according to claim 1, wherein the insulation structure further comprises an insulation medium, wherein the insulation medium wraps around the insulation structure. ### Claim 22 An electronic device, comprising an insulation structure, wherein the insulation structure comprises: a first substrate, wherein the first substrate comprises a first surface and a second surface oppositely disposed; a first conductive body, wherein the first conductive body is disposed on the first surface; a first groove disposed on the first surface of the first substrate, wherein an opening of the first groove is located on the first surface, a preset thickness is reserved between a bottom of the first groove and the second surface, and the first groove is adjacent to the first conductive body; wherein a surface of the first groove is provided with a first conductive layer, and the first conductive layer is electrically connected with the first conductive body. ### Claim 23 (depends on 22) The electronic device according to claim 22, wherein the electronic device comprises any one of a transformer, an inductor, a PCB-based busbar, and a power device packaging module.