# US 12,772,386 B2 · Circuit board assembly manufacturing method, circuit board assembly manufactured by same, and electric vehicle including same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,772,386 B2 - Document ID: US12772386B2 - Status: Granted - Kind: B2 - Application number: 17/800,775 - Filed: 2021-06-15 - Published: 2023-03-30 - Granted: 2026-10-20 - Earliest claimed: 2020-06-23 - Assignees: LG Energy Solution, Ltd. - Applicants: LG Energy Solution, Ltd. - Inventors: Bum Jick Lee; Young Su Son - Web page: https://patentgrep.com/patent/US12772386B2 ## CPC - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - B60L 58/10: for monitoring or controlling batteries - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B60L: PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES (arrangements or mounting of electrical propulsion units or of plural diverse prime-movers for mutual or common propulsion in vehicles B60K1/00, B60K6/20; arrangements or mounting of electrical gearing in vehicles B60K17/12, B60K17/14; preventing wheel slip by reducing power in rail vehicles B61C15/08; dynamo-electric machines H02K; control or regulation of electric motors H02P); SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES (electric coupling devices combined with mechanical couplings of vehicles B60D1/64; electric heating for vehicles B60H1/00); ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL (control or regulation of electric motors H02P); MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES ## Abstract The present invention relates to a method for manufacturing a circuit board assembly, which includes: mounting a plurality of components on a circuit board; preparing a mold comprising a concave portion corresponding to a shape of each of the plurality of components and a convex portion corresponding to a surface of the circuit board; providing the mold at an upper side of the circuit board and preparing a protective material to be disposed on the circuit board; disposing the protective material on the circuit board and the components by using the mold; and curing the protective material to form a protective layer. ## Claims ### Claim 1 A method for manufacturing a circuit board assembly, the method comprising: preparing a mold comprising a concave portion corresponding to a shape of each of a plurality of components and a convex portion corresponding to a surface of a circuit board, the convex portion of the mold being located between the plurality of components; mounting the plurality of components on the circuit board; providing the mold at an upper side of the circuit board and preparing a protective material to be disposed on the circuit board; disposing the protective material on the circuit board and the plurality of components by using the mold; and curing the protective material to form a protective layer. ### Claim 2 (depends on 1) The method of claim 1, wherein the preparing of the protective material to be disposed on the circuit board comprises disposing the protective material between the circuit board and the mold, and the disposing of the protective material on the circuit board and the plurality of components by using the mold comprises pressing the mold to allow the protective material to be in contact with the circuit board and the plurality of components. ### Claim 3 (depends on 2) The method of claim 2, wherein the protective material has a width greater than that of the circuit board and a thickness greater than an interval between the concave portion and each of the plurality of components. ### Claim 4 (depends on 3) The method of claim 3, wherein predetermined vibration is applied to the protective material through the mold. ### Claim 5 (depends on 1) The method of claim 1, wherein the preparing of the protective material to be disposed on the circuit board comprises allowing a container, in which the protective material is stored in a melted form, to communicate with the mold, and the disposing of the protective material on the circuit board and the plurality of components by using the mold comprises injecting the melted protective material through the mold to allow the circuit board and the plurality of components to be in contact with the melted protective material. ### Claim 6 (depends on 5) The method of claim 5, wherein the mold is controlled in a range of a predetermined temperature that is greater than room temperature and less than a melting temperature of the protective material. ### Claim 7 (depends on 6) The method of claim 6, wherein the melted protective material is injected through tubes, which are formed to pass through the convex portion, and air is exhausted through tubes, which are formed to pass through the concave portion, among a plurality of tubes formed to pass through the concave portion and the convex portion of the mold. ### Claim 8 (depends on 7) The method of claim 7, wherein the air is exhausted through a filter provided in an opening of each of the tubes, which are formed to pass through the concave portion, to suppress or prevent leakage of the melted protective material. ### Claim 9 (depends on 1) The method of claim 1, wherein the concave portion has a depth greater than a height of each of the components and a width greater than that of each of the components. ### Claim 10 (depends on 9) The method of claim 9, wherein an interval between the concave portion and the convex portion corresponds to a thickness of the protective layer. ### Claim 11 (depends on 1) The method of claim 1, wherein the protective material comprises a hot melt resin, a photocurable resin, a thermosetting resin, a wet resin, or a combination thereof. ### Claim 12 (depends on 1) The method of claim 1, wherein the protective layer is formed to have a same thickness on an upper portion of the circuit board and side and top surfaces of each of the components. ### Claim 13 (depends on 1) The method of claim 1, wherein at least one region of the protective layer is formed to have a different thickness than other regions of the protective layer. ### Claim 14 (depends on 1) The method of claim 1, wherein the protective layer has a thickness of 5 micrometers (μm) to 1 millimeter (mm). ### Claim 15 (depends on 1) A circuit board assembly manufactured through the method of claim 1. ### Claim 16 (depends on 1) An electric vehicle comprising a battery that provides electric energy, a battery management system (BMS) that manages the battery, a controller that controls a state of the electric vehicle, and a motor that drives the electric vehicle, wherein the BMS is a first component of a first circuit board assembly, wherein the controller is a second component of a second circuit board assembly, and wherein the first circuit board assembly and the second circuit board assembly are manufactured by the method of claim 1. ### Claim 17 (depends on 1) The method of claim 1, wherein an interval between a side surface of a component of the plurality of components and a side surface of the concave portion is less than an interval between a top surface of the component of the plurality of components and a bottom surface of the concave portion.