# US 12,772,384 B2 · Method for manufacturing wiring substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,772,384 B2 - Document ID: US12772384B2 - Status: Granted - Kind: B2 - Application number: 18/174,723 - Filed: 2023-02-27 - Published: 2023-08-31 - Granted: 2026-10-20 - Earliest claimed: 2022-02-28 - Assignees: Ibiden Co., Ltd. - Applicants: Ibiden Co., Ltd. - Inventors: Yasushi Usami - Web page: https://patentgrep.com/patent/US12772384B2 ## CPC - H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)} - H05K 1/0269: {for visual or optical inspection} - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 1/14: Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00) - H05K 3/007: {Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K1/187, H05K3/20 and H05K3/4682 take precedence)} - H05K 3/202: {using self-supporting metal foil pattern} - H05K 3/3465: Application of solder - H05K 1/0268: {for electrical inspection or testing} - H05K 3/4038: {Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence)} - H05K 2203/162: Testing a finished product, e.g. heat cycle testing of solder joints - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A method for manufacturing a wiring substrate includes preparing a first support plate having a metal foil formed on surface of a support substrate, forming a wiring substrate on the foil such that the wiring substrate has first surface facing the foil, attaching a second support plate to second surface of the wiring substrate, and separating the support substrate from the foil after attaching the second support plate such that the foil is removed from the first surface and that the first surface is exposed. The wiring substrate has first conductor pads on the first surface, and second conductor pads on the second surface, and the method includes conducting first inspection such that conduction between the second pads is inspected before attaching the second plate to the second surface, and conducting second inspection such that conduction between the first pads is inspected after removing the foil from the first surface. ## Claims ### Claim 1 A method for manufacturing a wiring substrate, comprising: preparing a first support plate having a metal foil formed on a surface of a support substrate; forming a wiring substrate on the metal foil of the first support plate such that the wiring substrate has a first surface facing the metal foil of the first support plate; attaching a second support plate to a second surface of the wiring substrate on an opposite side with respect to the first surface; and separating the support substrate from the metal foil of the first support plate after the attaching of the second support plate such that the metal foil of the first support plate is removed from the first surface of the wiring substrate and that the first surface of the wiring substrate is exposed, wherein the wiring substrate has a plurality of first conductor pads formed on the first surface, and a plurality of second conductor pads formed on the second surface, the method for manufacturing the wiring substrate includes conducting a first conduction inspection such that conduction between the plurality of second conductor pads is inspected before the attaching of the second support plate to the second surface of the wiring substrate, and conducting a second conduction inspection such that conduction between the plurality of first conductor pads is inspected after the removing of the metal foil from the first surface of the wiring substrate, and the first conduction inspection is conducted in a state in which the first support plate is attached to the first surface, and the second conduction inspection is conducted in a state in which the second support plate is attached to the second surface. ### Claim 2 (depends on 1) The method for manufacturing a wiring substrate according to claim 1, wherein the metal foil of the first support plate includes a first layer and a second layer. ### Claim 3 (depends on 2) The method for manufacturing a wiring substrate according to claim 2, wherein the first conduction inspection includes an open inspection between the plurality of second conductor pads. ### Claim 4 (depends on 3) The method for manufacturing a wiring substrate according to claim 3, wherein the first conduction inspection includes the open inspection between the plurality of second conductor pads that electrically connect to different conductor pads of the first conductor pads via different conductor paths, respectively. ### Claim 5 (depends on 2) The method for manufacturing a wiring substrate according to claim 2, wherein the second conduction inspection includes a short inspection between the plurality of first conductor pads of the wiring substrate. ### Claim 6 (depends on 5) The method for manufacturing a wiring substrate according to claim 5, wherein the second conduction inspection includes the short inspection between the plurality of first conductor pads that are to be electrically separated. ### Claim 7 (depends on 5) The method for manufacturing a wiring substrate according to claim 5, wherein the separating of the support substrate from the metal foil of the first support plate includes separating the first layer from the second layer. ### Claim 8 (depends on 2) The method for manufacturing a wiring substrate according to claim 2, further comprising: forming a solder resist layer on a surface of the second support plate on an opposite side with respect to the wiring substrate before the second conduction inspection. ### Claim 9 (depends on 1) The method for manufacturing a wiring substrate according to claim 1, wherein the first conduction inspection includes an open inspection between the plurality of second conductor pads. ### Claim 10 (depends on 9) The method for manufacturing a wiring substrate according to claim 9, wherein the first conduction inspection includes the open inspection between the plurality of second conductor pads that electrically connect to different conductor pads of the first conductor pads via different conductor paths, respectively. ### Claim 11 (depends on 10) The method for manufacturing a wiring substrate according to claim 10, wherein the metal foil of the first support plate includes a first layer and a second layer, and the separating of the support substrate from the metal foil of the first support plate includes separating the first layer from the second layer. ### Claim 12 (depends on 10) The method for manufacturing a wiring substrate according to claim 10, further comprising: forming a solder resist layer on a surface of the second support plate on an opposite side with respect to the wiring substrate before the second conduction inspection. ### Claim 13 (depends on 9) The method for manufacturing a wiring substrate according to claim 9, wherein the second conduction inspection includes a short inspection between the plurality of first conductor pads of the wiring substrate. ### Claim 14 (depends on 13) The method for manufacturing a wiring substrate according to claim 13, wherein the second conduction inspection includes the short inspection between the plurality of first conductor pads that are to be electrically separated. ### Claim 15 (depends on 9) The method for manufacturing a wiring substrate according to claim 9, wherein the metal foil of the first support plate includes a first layer and a second layer, and the separating of the support substrate from the metal foil of the first support plate includes separating the first layer from the second layer. ### Claim 16 (depends on 9) The method for manufacturing a wiring substrate according to claim 9, further comprising: forming a solder resist layer on a surface of the second support plate on an opposite side with respect to the wiring substrate before the second conduction inspection. ### Claim 17 (depends on 1) The method for manufacturing a wiring substrate according to claim 1, wherein the second conduction inspection includes a short inspection between the plurality of first conductor pads of the wiring substrate. ### Claim 18 (depends on 17) The method for manufacturing a wiring substrate according to claim 17, wherein the second conduction inspection includes the short inspection between the plurality of first conductor pads that are to be electrically separated. ### Claim 19 (depends on 1) The method for manufacturing a wiring substrate according to claim 1, wherein the metal foil of the first support plate includes a first layer and a second layer, and the separating of the support substrate from the metal foil of the first support plate includes separating the first layer from the second layer. ### Claim 20 (depends on 1) The method for manufacturing a wiring substrate according to claim 1, further comprising: forming a solder resist layer on a surface of the second support plate on an opposite side with respect to the wiring substrate before the second conduction inspection.