# US 12,772,363 B2 · Electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,772,363 B2 - Document ID: US12772363B2 - Status: Granted - Kind: B2 - Application number: 18/923,994 - Filed: 2024-10-23 - Published: 2025-05-29 - Granted: 2026-10-20 - Earliest claimed: 2023-11-27 - Assignees: Innolux Corporation - Applicants: InnoLux Corporation - Inventors: Tsung-Yu Yang; Ming-Huang Chen; Chuan-Chi Chien - Web page: https://patentgrep.com/patent/US12772363B2 ## CPC - H05F 1/00: Preventing the formation of electrostatic charges - H05F: STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY ## Abstract An electronic device is provided. The electronic device includes a first panel including a first substrate, a second substrate, a plurality of first conductive pads, a first conductive ring, and a first electrostatic protection structure. The first substrate includes a first electronic component bonding area. The second substrate is disposed opposite to the first substrate. The plurality of first conductive pads are disposed on the first electronic component bonding area. The first conductive ring is disposed on the first substrate. The first electrostatic protection structure includes a first line end portion and a second line end portion that are opposite to each other. The first line end portion is connected to one of the plurality of first conductive pads. The second line end portion is connected to the first conductive ring. Moreover, the first conductive ring is electrically connected to a ground potential. ## Claims ### Claim 1 An electronic device, comprising: a first panel, comprising: a first substrate comprising a first electronic component bonding area; a second substrate disposed opposite to the first substrate; a plurality of first conductive pads disposed on the first electronic component bonding area; a first conductive ring disposed on the first substrate; and a first electrostatic protection structure comprising a first line end portion and a second line end portion that are opposite to each other, wherein the first line end portion is connected to one of the plurality of first conductive pads, the second line end portion is connected to the first conductive ring, and the first conductive ring is electrically connected to a ground potential. ### Claim 2 (depends on 1) The electronic device as claimed in claim 1, further comprising a first sealant disposed between the first substrate and the second substrate and comprising a plurality of conductive particles, wherein a portion of the first conductive ring overlaps with the first sealant, and a width of the first conductive ring is greater than a width of at least one of the plurality of conductive particles. ### Claim 3 (depends on 2) The electronic device as claimed in claim 2, wherein the width of at least one of the plurality of conductive particles is greater than or equal to 5 micrometers and less than or equal to 10 micrometers. ### Claim 4 (depends on 1) The electronic device as claimed in claim 1, wherein the first panel further comprises another first conductive ring, and the another first conductive ring is connected in parallel to the first conductive ring. ### Claim 5 (depends on 1) The electronic device as claimed in claim 1, wherein the first panel further comprises a signal line, the signal line is adjacent to the first conductive ring, and a ratio of a width of the first conductive ring to a width of the signal line is greater than or equal to 2 and less than or equal to 20. ### Claim 6 (depends on 1) The electronic device as claimed in claim 1, wherein a width of the first conductive ring is greater than or equal to 20 micrometers and less than a width of the first sealant. ### Claim 7 (depends on 1) The electronic device as claimed in claim 1, wherein there is a spacing area between the first line end portion and the second line end portion, and the spacing area is separated from the one of the plurality of first conductive pads by a distance, and the distance is greater than or equal to 200 micrometers and less than or equal to 600 micrometers. ### Claim 8 (depends on 1) The electronic device as claimed in claim 1, wherein there is a spacing area between the first line end portion and the second line end portion, and a width of the spacing area is greater than or equal to 2.5 micrometers and less than or equal to 10 4 micrometers. ### Claim 9 (depends on 8) The electronic device as claimed in claim 8, wherein the first panel further comprises an insulating layer, the insulating layer is disposed on the first electrostatic protection structure, the insulating layer has an opening area, the opening area overlaps with the spacing area between the first line end portion and the second line end portion and exposes portions of the first line end portion and the second line end portion. ### Claim 10 (depends on 9) The electronic device as claimed in claim 9, wherein the exposed portions of the first line end portion and the second line end portion each has a width, and the width is greater than or equal to 1 micrometer and less than or equal to 6 micrometers. ### Claim 11 (depends on 1) The electronic device as claimed in claim 1, further comprising: a second panel disposed under the first panel, wherein the second panel comprises a second conductive ring electrically connected to a ground potential; a plurality of circuit boards, respectively electrically connected to the first conductive ring in the first panel and the second conductive ring in the second panel; and a control board electrically connected to the first conductive ring and the second conductive ring respectively through the plurality of circuit boards, wherein lengths of the plurality of circuit boards are different from each other. ### Claim 12 (depends on 11) The electronic device as claimed in claim 11, wherein the control board comprises a plurality of connecting components, and the plurality of circuit boards are electrically connected to the control board through the plurality of connecting components, and the plurality of connecting components are arranged in sequence along a direction, wherein the direction is an extending direction of a long side of the control panel or an extending direction of a short side of the control panel. ### Claim 13 (depends on 1) The electronic device as claimed in claim 1, wherein the first panel has an active area and a peripheral area adjacent to the active area, and the first electronic component bonding area is located in the peripheral area. ### Claim 14 (depends on 1) The electronic device as claimed in claim 1, wherein the first panel has an active area and a peripheral area adjacent to the active area, and the first conductive ring is located in the peripheral area and surrounding the active area. ### Claim 15 (depends on 1) The electronic device as claimed in claim 1, further comprising a first circuit board electrically connected to the first panel, wherein the first conductive ring partially overlaps with the first electronic component bonding area and the first circuit board. ### Claim 16 (depends on 1) The electronic device as claimed in claim 1, wherein the first line end portion and the second line end portion are formed by performing a laser cutting process on a line. ### Claim 17 (depends on 1) The electronic device as claimed in claim 1, wherein the first line end portion and the second line end portion are formed by performing a patterning process on a line. ### Claim 18 (depends on 1) The electronic device as claimed in claim 1, wherein the first panel further comprises a first electrode, a second electrode, a modulating material, and a spacer element disposed between the first substrate and the second substrate. ### Claim 19 (depends on 18) The electronic device as claimed in claim 18, wherein the spacer element does not overlap with an overlapping area of the first electrode and the second electrode. ### Claim 20 (depends on 1) The electronic device as claimed in claim 1, wherein the first conductive ring comprises a fracture structure located on a side of the first substrate different from the first electronic component bonding area.