# US 12,767,873 B2 · Thermally conductive film

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- Number: US 12,767,873 B2
- Document ID: US12767873B2
- Status: Granted
- Kind: B2
- Application number: 18/695,270
- Filed: 2022-08-23
- Published: 2024-11-28
- Granted: 2026-10-20
- Earliest claimed: 2021-09-27
- Assignees: Shin-Etsu Chemical Co., Ltd.
- Applicants: Shin-Etsu Chemical Co., Ltd.
- Inventors: Yasuhisa Ishihara; Emi Akabane; Akihiro Endo
- Web page: https://patentgrep.com/patent/US12767873B2

## CPC

- C09K 5/14: Solid materials, e.g. powdery or granular
- C08J 5/18: Manufacture of films or sheets
- C08K 3/013: Fillers, pigments or reinforcing additives
- C08L 83/04: Polysiloxanes
- C08L 91/06: Waxes
- C09D 183/06: containing silicon bound to oxygen-containing groups (C09D183/12 takes precedence)
- H10W 40/251: {Organics}
- C08G 77/20: containing silicon bound to unsaturated aliphatic groups
- C08J 2383/07: containing silicon bound to unsaturated aliphatic groups
- C08J 2491/06: Waxes
- C08K 2003/0812: {Aluminium}
- C08K 2003/2227: {of aluminium}
- C08K 2003/2296: {of zinc}
- C08K 2201/001: Conductive additives
- C08K 3/22: of metals
- C08K 3/08: Metals
- C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS

## Abstract

A thermally conductive film including: a silicone resin at 100 parts by mass, the silicone resin being one or more selected from: DmTφpDVin, wherein D represents a siloxane unit represented by (CH3)2SiO2/2, Tφ represents a siloxane unit represented by (C6H5)SiO3/2, DVi represents a siloxane unit represented by (CH3)(CH2═CH)SiO2/2, “m” represents an integer of 35 to 55, “n” represents an integer of 30 to 60, and “p” represents an integer of 40 to 70; or MLDxTφq DViy, wherein M represents (CH3)3SiO1/2, L represents an integer of 10 to 30, “x” represents an integer of 15 to 35, “y” represents an integer of 40 to 60, and “q” represents an integer of 45 to 55, the silicone resin having non-flowability at 25° C.; a wax having a melting point of 20 to 60° C. at 5 to 300 parts by mass; and a thermally conductive filler at 1,000 to 6,000 parts by mass.

## Claims

### Claim 1

A thermally conductive film, comprising:
a silicone resin (A) at 100 parts by mass, the silicone resin being one or more selected from the following formula (1) or (2):
DmTφpDVin (1)
wherein D represents a siloxane unit represented by (CH3)2SiO2/2, Tφ represents a siloxane unit represented by (C6H5)SiO3/2, DVi represents a siloxane unit represented by (CH3)(CH2═CH)SiO2/2, “m” represents an integer of 35 to 55, “n” represents an integer of 30 to 60, “p” represents an integer of 40 to 70, (m+n)/m=1.0 to 4.0, and (m+n)/p=0.25 to 4.0;
MLDxTφqDViy (2)
wherein M represents (CH3)3SiO1/2, D, Tφ, and DVi represent the same as above, L represents an integer of 10 to 30, “x” represents an integer of 15 to 35, “y” represents an integer of 40 to 60, “q” represents an integer of 45 to 55, L/(x+y)=0.001 to 0.4, (x+y)/x=1.0 to 4.0, and (x+y)/q=0.25 to 4.0,
the silicone resin having non-flowability at 25° C.;
a wax (B) having a melting point of 20 to 60° C. at 5 to 300 parts by mass, the melting point being measured with a differential scanning calorimeter in accordance with JIS K7121:2012; and
a thermally conductive filler (C) at 1,000 to 6,000 parts by mass relative to 100 parts by mass of the component (A).

### Claim 2 (depends on 1)

The thermally conductive film according to claim 1, wherein the component (A) has a softening point of 30 to 65° C., the softening point being measured by using a softening point measurement apparatus in accordance with JIS K2207:1996.

### Claim 3 (depends on 1)

The thermally conductive film according to claim 1, wherein the wax of the component (B) is one or more selected from a paraffin wax, an ester wax, and a silicone wax.

### Claim 4 (depends on 2)

The thermally conductive film according to claim 2, wherein the wax of the component (B) is one or more selected from a paraffin wax, an ester wax, and a silicone wax.

### Claim 5 (depends on 1)

The thermally conductive film according to claim 1, wherein the thermally conductive filler of the component (C) is one or more selected from silver, aluminum, alumina, aluminum nitride, aluminum hydroxide, magnesia, and zinc oxide.

### Claim 6 (depends on 2)

The thermally conductive film according to claim 2, wherein the thermally conductive filler of the component (C) is one or more selected from silver, aluminum, alumina, aluminum nitride, aluminum hydroxide, magnesia, and zinc oxide.

### Claim 7 (depends on 3)

The thermally conductive film according to claim 3, wherein the thermally conductive filler of the component (C) is one or more selected from silver, aluminum, alumina, aluminum nitride, aluminum hydroxide, magnesia, and zinc oxide.

### Claim 8 (depends on 4)

The thermally conductive film according to claim 4, wherein the thermally conductive filler of the component (C) is one or more selected from silver, aluminum, alumina, aluminum nitride, aluminum hydroxide, magnesia, and zinc oxide.