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US 12,765,437 B2Granted
Semiconductor device and manufacturing method thereof
AssigneeMediatek Inc.
InventorsPu-Shan Huang, Chi-Yuan Chen, Shih-Chin Lin
Life of this patent
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Abstract
A semiconductor device is provided. The semiconductor device includes a carrier, an electronic component, an adapter, a first metal wire and a second metal wire. The electronic component is disposed on the carrier. The adapter is disposed on the carrier. The first metal wire connects the electronic component and the adapter. The second metal wire connects the adapter and the carrier.
Claims18
A semiconductor device, comprising:
- a carrier;
- an electronic component disposed on the carrier;
- an adapter disposed on the carrier and comprising a redistribution layer (RDL);
- a first metal wire connecting the electronic component and the adapter;
- a second metal wire connecting the adapter and the carrier;
- and
- a passive element disposed over the adapter and in contact with the RDL of the adapter.
4 more elements
A manufacturing method, comprising:
- disposing an electronic component on a carrier;
- disposing an adapter on the carrier, wherein the adapter comprises a RDL;
- disposing a passive element over the adapter, wherein the passive element is in contact with the RDL of the adapter;
- connecting the electronic component and the adapter by a first metal wire;
- connecting the adapter and the carrier by a second metal wire.
2 more elements
Dependencies are inferred from the claim text.