Semiconductor package and method for fabricating a semiconductor package for upright mounting

A semiconductor package, comprising:

• a low voltage contact pad;
• a high voltage contact pad;
• an output contact pad;
• a half-bridge circuit comprising a first transistor device and a second transistor device coupled in series at an output node, wherein the first transistor device has a first major surface, wherein the second transistor device has a first major surface, and wherein both the first transistor device and of the second transistor device are oriented substantially perpendicular with respect to each of the low voltage contact pad, the high voltage contact pad and the output contact pad;
• a first lead;
• a second lead;
• and
• a third lead;
• wherein the first and second transistor devices are arranged in a device portion of the semiconductor package and are mounted on the first lead,
• wherein a bent part of the first lead forms the output contact pad and is arranged on a first side of the device portion,
• wherein the second and third leads are arranged in a common plane on a second side of the device portion that opposes the first side,
• wherein a bent part of the second lead forms the low voltage contact pad, and
• wherein a bent part of the third lead forms the high voltage contact pad.