Semiconductor structures and method for manufacturing a semiconductor structure

A semiconductor structure comprising:

• a dielectric layer;
• a first redistribution layer (RDL) disposed on a first surface of the dielectric layer;
• a plurality of bumps disposed on a second surface of the dielectric layer;
• a plurality of first micro bumps disposed on the first RDL;
• a plurality of conductive pillars disposed on the first RDL;
• at least one bottom die attached to the plurality of first micro bumps;
• a first molding layer configured to fill spaces among and around the at least one bottom die and the plurality of conductive pillars on the first RDL;
• a second RDL disposed on the first molding layer, wherein the second RDL is coupled to the at least one bottom die, and the second RDL further coupled to the plurality of conductive pillars;
• a plurality of second micro bumps disposed on the second RDL;
• and
• a plurality of top dies attached to the plurality of second micro bumps.