Semiconductor package and method for manufacturing the same

A semiconductor package, comprising:

• a first redistribution layer structure;
• a first chiplet structure on the first redistribution layer structure;
• a plurality of connection members on the first redistribution layer structure;
• a first molding material on the first redistribution layer structure and molding the first chiplet structure and the plurality of connection members;
• a second redistribution layer structure on the first molding material;
• and
• a second chiplet structure on the second redistribution layer structure, wherein
• the first chiplet structure includes a third redistribution layer structure, a first chiplet and a second chiplet on the third redistribution layer structure, and a first bridge die on a bottom surface of the third redistribution layer structure,
• the second chiplet structure includes a fourth redistribution layer structure, a third chiplet and a fourth chiplet on the fourth redistribution layer structure, and a second bridge die on a bottom surface of the fourth redistribution layer structure.

A method for manufacturing a semiconductor package, comprising:

• forming a first redistribution layer structure on a first carrier;
• forming a plurality of connection members on the first redistribution layer structure;
• mounting a chiplet structure on the first redistribution layer structure;
• molding the plurality of connection members and the chiplet structure using a first molding material on the first redistribution layer structure;
• and
• forming a second redistribution layer structure on the first molding material, wherein
• the chiplet structure includes a third redistribution layer structure, a first chiplet and a second chiplet on the third redistribution layer structure, and a bridge die on a bottom surface of the third redistribution layer structure.