# US 12,765,430 B2 · Electronic apparatus

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,765,430 B2
- Document ID: US12765430B2
- Status: Granted
- Kind: B2
- Application number: 18/663,100
- Filed: 2024-05-14
- Published: 2024-09-05
- Granted: 2026-10-13
- Earliest claimed: 2019-07-29
- Assignees: Innolux Corporation
- Applicants: Innolux Corporation
- Inventors: Tang Chin Hung; Chin-Lung Ting; Chung-Kuang Wei; Ker-Yih Kao; Tong-Jung Wang; Chih-Yung Hsieh; Hao Jung Huang; I-Yin Li; Chia-Chi Ho; Yi Hung Lin; Cheng-Hsu Chou; Chia-Ping Tseng
- Web page: https://patentgrep.com/patent/US12765430B2

## CPC

- H10W 90/22: the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL
- H10D 1/64: Variable-capacitance diodes, e.g. varactors
- H10D 84/0149: {Manufacturing their interconnections or electrodes, e.g. source or drain electrodes}
- H10D 84/038: {using silicon technology, e.g. SiGe}
- H10D 84/811: {Combinations of field-effect devices and one or more diodes, capacitors or resistors}
- H10W 20/496: {Capacitor integral with wiring layers}
- H10W 70/614: {the multiple chips being integrally enclosed}
- H10W 90/10: Configurations of laterally-adjacent chips
- H10D 88/101: {comprising components on opposite major surfaces of semiconductor substrates}
- H10W 70/611: {for connecting multiple chips together}
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES

## Abstract

The disclosure provides an electronic apparatus. The electronic apparatus includes an insulator, a driving unit, an electronic unit, and a circuit unit. The driving unit is overlapped with the insulator. The electronic unit is overlapped with the insulator. The circuit unit is electrically connected to the driving unit. The driving unit receives a signal from the circuit unit and drives the electronic unit.

## Claims

### Claim 1

An electronic apparatus, comprising:
an insulator;
a driving unit, overlapped with the insulator;
an electronic unit, overlapped with the insulator; and
a circuit unit, electrically connected to the driving unit,
wherein the driving unit receives a signal from the circuit unit and drives the electronic unit,
wherein the electronic unit is a light emitting diode.

### Claim 2 (depends on 1)

The electronic apparatus of claim 1, wherein the electronic unit is an integrated circuit.

### Claim 3

An electronic apparatus, comprising:
an insulator;
a driving unit, overlapped with the insulator;
an electronic unit, overlapped with the insulator; and
a circuit unit, electrically connected to the driving unit,
wherein the driving unit receives a signal from the circuit unit and drives the electronic unit,
wherein the electronic unit is a PN junction assembly.

### Claim 4 (depends on 3)

The electronic apparatus of claim 3, wherein the PN junction assembly comprises a variable capacitor.

### Claim 5 (depends on 3)

The electronic apparatus of claim 3, wherein the driving unit comprises a glass substrate and at least one transistor, wherein the at least one transistor is disposed on the glass substrate.

### Claim 6 (depends on 3)

The electronic apparatus of claim 3, wherein the driving unit and the electronic unit are disposed on a same surface of the insulator.

### Claim 7

An electronic apparatus, comprising:
an insulator;
a driving unit, overlapped with the insulator;
an electronic unit, overlapped with the insulator; and
a circuit unit, electrically connected to the driving unit,
wherein the driving unit receives a signal from the circuit unit and drives the electronic unit,
wherein the driving unit is disposed on a first surface of the insulator, the electronic unit is disposed on a second surface of the insulator, and the first surface is different from the second surface.

### Claim 8 (depends on 7)

The electronic apparatus of claim 7, wherein the first surface is opposite to the second surface.

### Claim 9 (depends on 7)

The electronic apparatus of claim 7, wherein the driving unit is electrically connected to the electronic unit via a conductor disposed in the insulator.

### Claim 10 (depends on 7)

The electronic apparatus of claim 7, wherein the circuit unit is a chip.
