Encapsulation structure

Abstract

An encapsulation structure including a substrate, an isolation structure layer, a planarization layer, and a composite layer structure is disclosed. The isolation structure layer is disposed on the substrate and defines multiple sub-pixel areas. The planarization layer is disposed on the substrate, and has a peripheral portion surrounding and covering the isolation structure layer. A thickness of the peripheral portion increases as it approaches the isolation structure layer. The composite layer structure connects the substrate and covers the planarization layer and the isolation structure layer. The composite layer includes two barrier layers and an extension layer. The extension layer is located between and connects the two barrier layers. A thickness, a water vapor transmission rate, and ductility and malleability of the extension layer are respectively greater than a thickness, a water vapor transmission rate, and ductility and malleability of each of the two barrier layers.

Dependencies are inferred from the claim text.