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US 12,765,418 B2Granted
Method for panel-level thermo-compression bonding
AssigneeIntel Corporation
InventorsMinglu Liu, Andrey Gunawan, Gang Duan
Life of this patent
Estimating the term…
Abstract
The present disclosure is directed to a thermocompression bonding tool having a bond head with a surface for compression and heating and a sensor, a stage for compression and heating, and a controller, and a method for its use for chip gap height and alignment control. For chip gap height and alignment control, the controller is provided with a recipe displacement and temperature profile and measured offsets.
Claims12
A method comprising:
- providing a thermocompression bonding tool with a bond head, a stage, and a controller;
- performing a pre-production bonding test process using the thermocompression bonding tool;
- and
- obtaining from the pre-production bonding test measurements for inputs for use to generate offsets to provide the controller for chip gap height and alignment control,
- modifying a recipe displacement and temperature profile that includes temperatures and movements of the bond head associated with the bonding of the plurality of units with the thermocompression bonding tool, wherein the modifying the recipe displacement and temperate profile comprises the controller applying the offsets to the recipe displacement and temperature profile for production units undergoing a bonding process using the thermocompression bonding tool.
2 more elements
A method comprising:
- providing a thermocompression bonding tool with a bond head, a stage, a camera, and a controller;
- providing a plurality of units to undergo a production bonding process;
- performing a pre-production bonding test process to generate an alignment or displacement offset for a thermocompression bonding tool;
- modifying a recipe displacement and temperature profile by the alignment or displacement offset;
- inputting the modified recipe displacement and temperature profile for use by the controller;
- positioning each of the plurality of units on the stage and performing the bonding process on the unit using the thermocompression bonding tool;
- and
- controlling the bonding process with the controller to provide movements of the bond head to obtain a desired chip gap height and alignment for the unit;
- wherein the recipe displacement and temperature profile comprises temperatures and movements of the bond head associated with a bonding of the plurality of units with the thermocompression bonding tool.
6 more elements
Dependencies are inferred from the claim text.