Semiconductor package with metal posts from structured leadframe

A method of forming a semiconductor package, the method comprising:

• providing a metal baseplate comprising a base section and a plurality of metal posts, the base section being a planar pad of substantially uniform thickness, the plurality of metal posts each extending up from a planar upper surface of the base section;
• mounting a semiconductor die on the upper surface of the base section in a flip chip arrangement wherein a main surface of the semiconductor die that comprises terminals faces the metal baseplate and vertical connectors extend between the terminals and the planar upper surface of the base section;
• forming an encapsulant body of electrically insulating mold compound on the metal baseplate that encapsulates the semiconductor die and covers;
• removing the base section thereby detaching the metal posts from one another and exposing ends of the vertical connectors at a first surface of the encapsulant body;
• and
• forming contact pads at a first side of the semiconductor package that are electrically connected to the terminals of the semiconductor die,
• wherein the encapsulant body is formed such that first ends of the metal posts that face away from the upper surface of the baseplate are covered by the mold compound.