# US 12,765,414 B2 · System in a package (SIP) with air cavity and epoxy seal

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- Number: US 12,765,414 B2
- Document ID: US12765414B2
- Status: Granted
- Kind: B2
- Application number: 18/197,994
- Filed: 2023-05-16
- Published: 2023-12-14
- Granted: 2026-10-13
- Earliest claimed: 2022-06-10
- Assignees: Qorvo US, Inc.
- Applicants: Qorvo US, Inc.
- Inventors: MD Hasnine; Christine Blair; Thomas Scott Morris; Neftali Salazar
- Web page: https://patentgrep.com/patent/US12765414B2

## CPC

- H10W 76/15: Containers comprising an insulating or insulated base
- H10W 72/071: {Connecting or disconnecting}
- H10W 74/014: {using batch processing}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A system in package (SiP) with an air cavity is disclosed. In one aspect, a technique to bond a lid over the air cavity that reduces the risk of cavity integrity failure is provided. More specifically, an epoxy seal is created on four walls of a lid enclosing the cavity. A further sputtered metal layer is added over the epoxy seal to provide additional structural rigidity, electromagnetic emission suppression and to assist in preventing leaks through the epoxy seal.

## Claims

### Claim 1

A system in a package (SiP) comprising:
a substrate comprising a first surface;
a lid comprising a generally planar element and a wall element extending generally perpendicularly from the planar element, the wall element having a lip surface generally parallel to the first surface, the lip surface coupled to the first surface with a first epoxy, and wherein the wall element comprises an exterior surface generally perpendicular to the lip surface, wherein the wall element delimits an aperture spaced from the lip surface; and
a second epoxy coupled to the first epoxy and covering the exterior surface from the lip surface to the generally planar element.

### Claim 2 (depends on 1)

The SiP of claim 1, further comprising a sputtered metal layer covering the second epoxy and an exposed portion of the lid.

### Claim 3 (depends on 2)

The SiP of claim 2, wherein the sputtered metal layer comprises a plurality of metal layers.

### Claim 4 (depends on 3)

The SiP of claim 3, wherein the plurality of metal layers comprises at least a stainless steel and a copper layer.

### Claim 5 (depends on 1)

The SiP of claim 1, further comprising a die positioned on the first surface of the substrate in an air cavity formed by the lid.

### Claim 6 (depends on 1)

The SiP of claim 1, further comprising a chiplet positioned on the first surface of the substrate in an air cavity formed by the lid.

### Claim 7 (depends on 1)

The SiP of claim 1, wherein the second epoxy fills the aperture.

### Claim 8 (depends on 1)

The SiP of claim 1, wherein the aperture is configured to act as a vent during manufacture to prevent overpressure in an air cavity formed by the lid.

### Claim 9 (depends on 1)

The SiP of claim 1, further comprising a component positioned on the first surface of the substrate in an air cavity formed by the lid.

### Claim 10 (depends on 1)

The SiP of claim 1, wherein the substrate comprises an FR4 material.

### Claim 11 (depends on 1)

The SiP of claim 1, wherein the lid comprises an FR4 material.

### Claim 12

A communication device comprising:
a communication circuit positioned in a package, the package comprising:
a substrate comprising a first surface;
a lid comprising a generally planar element and a wall element extending generally perpendicularly from the planar element, the wall element having a lip surface generally parallel to the first surface, the lip surface coupled to the first surface with a first epoxy, and wherein the wall element comprises an exterior surface generally perpendicular to the lip surface, wherein the wall element delimits an aperture spaced from the lip surface; and
a second epoxy coupled to the first epoxy and covering the exterior surface from the lip surface to the generally planar element.