Mounting head

A mounting head for bonding a chip to a bonding target, the mounting head comprising:

• a mounting tool having a bottom surface which functions as a suction surface for sucking and holding the chip;
• a heater arranged on a surface of the mounting tool opposite to the suction surface and heating the mounting tool;
• a cooling mechanism having a plurality of cooling channels, which are independent of one another and guide a refrigerant respectively to a plurality of cooling areas set in the heater, and being capable of cooling the plurality of cooling areas independently of one another;
• and
• a controller controlling driving of the heater and the cooling mechanism,
• wherein the controller independently controls a flow rate of the refrigerant flowing through the plurality of cooling channels so as to obtain a desired temperature distribution during heating of the heater, and
• wherein the controller stores in advance condition data, which records a relationship among a temperature distribution, a driving condition of the heater, and the flow rate of the refrigerant flowing through the plurality of cooling channels, and controls the driving of the heater and the cooling mechanism based on the condition data.