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US 12,765,403 B2Granted
Integrated package device, fabrication method thereof and memory system
AssigneeYangtze Memory Technologies Co., Ltd.
InventorsXinru Zeng, Peng Chen
Life of this patent
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Abstract
The present application provides an integrated package device, a method of fabricating an integrated package device, and a memory system. The integrated package device may include at least one package module. Each package module may include a first sub-package module with a first electronic devices. Each package module may include a second sub-package module including a second electronic devices. Each package module may include a first re-distribution layer connected with first pads. Each package module may include a second re-distribution layer connected with second pads.
Claims17
An integrated package device, comprising:
- at least one package module, comprising:
- a first sub-package module comprising first electronic devices and a first molding body encapsulating the first electronic devices, and each of the first electronic devices including a first pad on a side thereof;
- a second sub-package module stacked on a side of the first sub-package module away from the first pad and comprising second electronic devices and a second molding body encapsulating the second electronic devices, each of the second electronic devices including a second pad on a side thereof;
- a first re-distribution layer located on a side of the first sub-package module away from the second sub-package module and connected with the first pads;
- a second re-distribution layer located on a side of the second sub-package module away from the first sub-package module and connected with each of the second pads;
- and
- a through-molding via (TMV) extending through both the first molding body and the second molding body and connecting the first re-distribution layer and the second re-distribution layer,
- wherein the first electronic devices comprise:
- a first set of NAND memory devices including a first NAND memory device stacked over a second NAND memory device and disposed in a first column of electronic devices;
- and
- a second set of NAND memory devices including a third NAND memory device stacked over a fourth NAND memory device and disposed in a second column of electronic devices laterally spaced from the first column in a direction perpendicular to a direction in which the first sub-package module and the second sub-package module are stacked.
8 more elements
A memory system, comprising:
- an integrated package device, comprising:
- at least one package module, comprising:
- a first sub-package module comprising a first electronic devices and a first molding body encapsulating the first electronic devices, and each of the first electronic devices including a first pad on a side thereof;
- a second sub-package module stacked on a side of the first sub-package module away from the first pad and comprising a second electronic devices and a second molding body encapsulating the second electronic devices, each of the second electronic devices including a second pad on a side thereof;
- a first re-distribution layer located on a side of the first sub-package module away from the second sub-package module and connected with the first pads;
- a second re-distribution layer located on a side of the second sub-package module away from the first sub-package module and connected with each of the second pads;
- and
- a through-molding via (TMV) extending through both the first molding body and the second molding body and connecting the first re-distribution layer and the second re-distribution layer,
- wherein the first electronic devices comprise:
- a first set of NAND memory devices including a first NAND memory device stacked over a second NAND memory device and disposed in a first column of electronic devices;
- and
- a second set of NAND memory devices including a third NAND memory device stacked over a fourth NAND memory device and disposed in a second column of electronic devices laterally spaced from the first column in a direction perpendicular to a direction in which the first sub-package module and the second sub-package module are stacked;
- and
- wherein one or more of at least one of the first electronic devices or at least one of the second electronic devices in the integrated package device comprise a memory device and at least any other one of the first electronic devices or at least any other one of the second electronic devices comprise a controller to control operations of the memory device.
11 more elements
Dependencies are inferred from the claim text.