# US 12,765,396 B2 · Semiconductor leadframe packages and related methods

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- Number: US 12,765,396 B2
- Document ID: US12765396B2
- Status: Granted
- Kind: B2
- Application number: 18/664,567
- Filed: 2024-05-15
- Published: 2025-08-14
- Granted: 2026-10-13
- Earliest claimed: 2024-02-12
- Assignees: Semiconductor Components Industries, LLC
- Applicants: Semiconductor Components Industries, LLC
- Inventors: Lijuan Wang; Ian Ceazar Bucayon Barias; Sen Sun
- Web page: https://patentgrep.com/patent/US12765396B2

## CPC

- H10W 70/411: {Chip-supporting parts, e.g. die pads}
- H10W 70/048: {Mechanical treatments, e.g. punching, cutting, deforming or cold welding}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

In implementations of a leadframe for a semiconductor package, the leadframe may include a die attach pad including a swag area; and one or more leads. The swag area may include an alternating pattern therein including at least two raised features, where each of the at least two raised features may be configured to support a clamping finger during a wirebonding process.

## Claims

### Claim 1

A leadframe for a semiconductor package, the leadframe comprising:
a die attach pad comprising a swag area; and
one or more leads;
wherein the swag area comprises an alternating pattern therein comprising at least two raised features and two downset features, the at least two raised features comprising a surface coplanar with a surface of the die attach pad, the surface of each of the at least two raised features configured to contact a clamping finger during a wirebonding process.

### Claim 2 (depends on 1)

The leadframe of claim 1, wherein the swag area extends along two opposing sides of the die attach pad.

### Claim 3 (depends on 1)

The leadframe of claim 1, wherein the alternating pattern is located in a first largest planar surface of the swag area and located in a second largest planar surface of the swag area opposing the first largest planar surface.

### Claim 4 (depends on 1)

The leadframe of claim 1, wherein the at least two downset features comprise corners, the corners comprising a substantially 90 degree angle.

### Claim 5 (depends on 1)

The leadframe of claim 1, wherein the at least two downset features comprise corners, the corners comprising a rounded shape.

### Claim 6 (depends on 1)

The leadframe of claim 1, wherein the at least two downset features comprise corners, the corners comprising a chamfered edge, a fileted edge, or a rounded edge.

### Claim 7 (depends on 1)

The leadframe of claim 1, wherein the at least two downset features comprising a mold lock pattern formed therein.

### Claim 8 (depends on 7)

The leadframe of claim 7, wherein the mold lock pattern is a dimpled pattern.

### Claim 9

A leadframe for a semiconductor package, the leadframe comprising:
a die attach pad comprising a swag area; and
one or more leads;
wherein the swag area comprises an alternating pattern of indentations therein; and
wherein the die attach pad is configured to receive a die thereon between the swag area extending along two opposing sides of the die attach pad.

### Claim 10 (depends on 9)

The leadframe of claim 9, wherein two or more raised features of the alternating pattern of indentations are configured to engage with a clamping finger during a wirebonding process.

### Claim 11 (depends on 9)

The leadframe of claim 9, wherein the swag area extends along two opposing sides of the die attach pad and wherein the alternating pattern of indentations is located in a first largest planar surface of the swag area and located in a second largest planar surface of the swag area opposing the first largest planar surface.

### Claim 12 (depends on 9)

The leadframe of claim 9, wherein the indentations of the alternating pattern of indentations comprise at least two downset features.

### Claim 13 (depends on 12)

The leadframe of claim 12, wherein the at least two downset features comprise corners, the corners comprising a substantially 90 degree angle.

### Claim 14 (depends on 12)

The leadframe of claim 12, wherein the at least two downset features comprise corners, the corners comprising a rounded shape.

### Claim 15 (depends on 12)

The leadframe of claim 12, wherein the at least two downset features comprise corners, the corners comprising a chamfered edge, a fileted edge, or a rounded edge.

### Claim 16 (depends on 12)

The leadframe of claim 12, wherein the at least two downset features comprise a mold lock pattern formed therein.

### Claim 17

A leadframe for a semiconductor package, the leadframe comprising:
a die attach pad comprising a swag area; and
one or more leads;
wherein the swag area comprises a pattern comprising alternating raised features and downset features;
wherein the downset features comprise a mold lock.

### Claim 18 (depends on 17)

The leadframe of claim 17, wherein the raised features comprise a surface coplanar with a surface of the die attach pad.