Device-to-device communication system, packages, and package system

A device, comprising:

• a first package, comprising:
• a first chiplet on a first carrier having a dielectric having two parallel sides and a first antenna feed port formed on a first of the two parallel sides of the dielectric of the first carrier;
• and
• a first antenna on a second carrier having two parallel sides and a first radio frequency feed port formed on a first of the two parallel sides of the second carrier and the first antenna formed on a second side of the two parallel sides, the first sides facing each other and the first antenna feed port coupled to the first radio frequency feed port forming a radio frequency signal interface;
• a second package, comprising:
• a second chiplet on a third carrier having a dielectric having two parallel sides and a second antenna feed port formed on a first of the two parallel sides of the dielectric of the third carrier;
• and
• a second antenna on a fourth carrier having two parallel sides and a second radio frequency feed port formed on a first of the two parallel sides of the fourth carrier and the second antenna formed on a second side of the two parallel sides, the first sides facing each other and the second antenna feed port coupled to the second radio frequency feed port forming a radio frequency signal interface;
• and
• a common carrier, wherein the first package and the second package are disposed in a common plane on the common carrier, and wherein the first package and the second package are wirelessly communicatively coupled to each other via the first antenna and the second antenna.