Method for making a semiconductor device

A method for making a semiconductor device, the method comprising:

• providing a substrate comprising an interconnection structure and a conductive bar connected to the interconnection structure;
• forming at least one electronic component on the substrate;
• forming an encapsulant layer covering the at least one electronic component;
• removing a portion of the encapsulant layer and a portion of the substrate which is at least partially under the portion of the encapsulant layer to expose at least a portion of the conductive bar;
• depositing a conductive material on the substrate to form a shielding layer on the substrate, wherein the shielding layer extends at least partially over the portion of the conductive bar exposed from the encapsulant layer and the substrate to electrically connect with the conductive bar;
• and
• providing on the substrate, on a side of the portion of the conductive bar exposed from the encapsulant layer and the substrate opposite to the encapsulant layer, a board-to-board connector.