# US 12,765,386 B2 · Manufacturing method of semiconductor device and semiconductor manufacturing apparatus

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- Number: US 12,765,386 B2
- Document ID: US12765386B2
- Status: Granted
- Kind: B2
- Application number: 18/460,521
- Filed: 2023-09-01
- Published: 2024-06-06
- Granted: 2026-10-13
- Earliest claimed: 2022-12-01
- Assignees: Kioxia Corporation
- Applicants: Kioxia Corporation
- Inventors: Soichi Homma
- Web page: https://patentgrep.com/patent/US12765386B2

## CPC

- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- G01N 21/255: {Details, e.g. use of specially adapted sources, lighting or optical systems}
- H10P 50/283: {by chemical means}
- H10W 74/01: Manufacture or treatment
- H10W 74/127: {characterised by arrangements for sealing or adhesion}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

According to one embodiment, a method of manufacturing a semiconductor device includes etching a sealing resin so that a filler inside the resin is exposed at an outer surface of the resin. The manufacturing method further includes determining the exposed amount of the filler after etching by measuring the optical properties of the surface of the resin. Additional etching may then be performed, if necessary, such that the appropriate amount of filler is exposed from the resin. In subsequent steps, a conductive film may be deposited on the surface of the resin. For example, the conductive film may be used as shield layer of the semiconductor device.

## Claims

### Claim 1

A manufacturing method, comprising:
etching a resin so that a filler is exposed from a surface of the resin containing the filler;
measuring an exposed amount of the filler by measuring optical properties of the surface of the resin; and
forming a conductive film on the surface of the resin after the measuring of the optical properties, wherein
measuring the optical properties of the surface of the resin includes:
measuring a color of the surface of the resin, and
calculating a color difference between a reference color and the measured color of the surface of the resin,
etching the resin includes a cleaning etch to clean the surface of the resin followed by a second etch to remove portions of the resin,
the cleaning etch and the second etch are each a plasma process,
the cleaning etch is performed using a first gas that includes argon and does not include nitrogen, and
the second etch is performed using a second gas that includes both argon and nitrogen.

### Claim 2 (depends on 1)

The manufacturing method according to claim 1, wherein the reference color is a measured color of the surface of the resin after the cleaning etch.

### Claim 3 (depends on 1)

The manufacturing method according to claim 1, wherein the reference color is a preset color set based on prior measurements of a reference sample.

### Claim 4 (depends on 1)

The manufacturing method according to claim 1, further comprising:
repeatedly performing the etching of the resin and the measuring of the optical properties of the surface of the resin until the measured optical properties reach a first predetermined value.

### Claim 5 (depends on 1)

The manufacturing method according to claim 1, further comprising:
changing etching conditions for a subsequent etching of the resin according to the measured optical properties.

### Claim 6 (depends on 1)

The manufacturing method according to claim 1, wherein the filler comprises at least one of silica, silicon dioxide, glass beads, alumina, aluminum nitride, boron nitride, beryllium oxide, carbon black, graphite, carbon fiber, metal powder, metal fiber, metal foil, mica, potassium titanate, xonotlite, ferrite, carbon nanotubes, titanium oxide, zinc oxide, iron oxide, calcium oxide, magnesium oxide, calcium carbonate, antimony oxide, aluminum hydroxide, magnesium hydroxide, zinc borate, zinc carbonate, hydrotalcite, and dawsonite.

### Claim 7 (depends on 1)

The manufacturing method according to claim 1, further comprising:
mounting a semiconductor chip on a substrate before the etching; and
covering the semiconductor chip with the resin before the etching.

### Claim 8 (depends on 1)

The manufacturing method according to claim 1, wherein measuring the optical properties further includes measuring a reflectance of the surface of the resin.

### Claim 9 (depends on 1)

The manufacturing method according to claim 1, wherein measuring the optical properties of the surface of the resin includes:
capturing an optical image of the surface of the resin, and
performing image processing on the captured optical image.