Coaxial I/O die comprising coaxial input/output (IO) connections, and coaxial probing tools for measuring RF signal performance and integrity

A semiconductor package, comprising:

• an interconnect;
• a mixed signal die having a first surface operably engaged with the interconnect and a second surface opposite to the first surface;
• and
• at least one set of input/output (IO) connections on the mixed signal die;
• wherein the at least one set of IO connections is configured to be electromagnetically shielded in a non-linear geometry from at least another set of IO connections that is different from the at least one set of IO connections;
• wherein the at least one set of IO connections further comprises:
• at least one radio frequency (RF) connection formed on the mixed signal die;
• the at least one RF connection comprises:
• a first bond pad;
• and
• a second bond pad circumferentially surrounded by the first bond pad in a continuous, non-linear geometry to electromagnetically shield the second bond pad.