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US 12,765,384 B2Granted
Package including a dummy bar and methods of forming the package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChing-Chen Li, Chin-Chuan Chang, Chen-Hsuan Tsai
Life of this patent
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Abstract
A package includes a first die and a second die in an encapsulant layer, and a dummy bar in the encapsulant layer and adjacent a gap between the first die and the second die. A method of forming a package includes attaching a first die and a second die to a surface, attaching a dummy bar to the surface adjacent a gap between the first die and the second die, and forming an encapsulant layer on the first die, the second die and the dummy bar.
Claims20
A package, comprising:
- a lower molding layer extending lengthwise in a first direction;
- a first die and a second die on the lower molding layer and separated by a gap extending lengthwise in a second direction perpendicular to the first direction;
- an encapsulant layer around the first die and the second die;
- and
- a dummy bar in the encapsulant layer and a outside the gap between the first die and the second die, wherein the dummy bar extends lengthwise in the first direction and a center of the dummy bar in the first direction is substantially aligned with a center of the gap in the first direction.
2 more elements
A method of forming a package, the method comprising:
- attaching a first die and a second die to a surface;
- attaching a dummy bar to the surface outside a gap between the first die and the second die;
- forming an encapsulant layer on the first die, the second die and the dummy bar;
- forming a lower molding layer on the first die and the second die, wherein the lower molding layer extends lengthwise in a first direction, the gap extends lengthwise in a second direction perpendicular to the first direction, the dummy bar extends lengthwise in the first direction and a center of the dummy bar in the first direction is substantially aligned with a center of the gap in the first direction.
1 more element
A package, comprising:
- a package substrate;
- a package module on the package substrate, comprising:
- a lower molding layer extending lengthwise in a first direction;
- a first die and a second die on the lower molding layer and separated by a gap extending lengthwise in a second direction perpendicular to the first direction;
- an encapsulant layer around the first die and the second die;
- and
- a dummy bar in the encapsulant layer and outside the gap between the first die and the second die, wherein the dummy bar extends lengthwise in the first direction and a center of the dummy bar in the first direction is substantially aligned with a center of the gap in the first direction;
- and
- a package lid on the package module and attached to the package substrate.
6 more elements
Dependencies are inferred from the claim text.