Remote heat sink side attach methodology

A method, comprising:

• applying a force on a vapor chamber (VC) so that the VC is pressed against a thermal interface material (TIM) disposed on an integrated circuit (IC), the VC is coupled with, and spaced from, a condenser;
• with the force still applied on the VC, securing the VC so that the VC is in a neutral position with respect to the TIM;
• and
• coupling the condenser with a base via a mounting bracket, which comprises:
• arranging the mounting bracket relative to a mounting arm of the condenser;
• securing the mounting bracket to the base with the mounting bracket arranged relative to the mounting arm;
• and
• securing the mounting bracket to the mounting arm via one or more horizontally-oriented fasteners.

An apparatus, comprising:

• a base;
• an integrated circuit (IC);
• a thermal interface material (TIM) disposed on the IC;
• a heat sink having a vapor chamber (VC) and a condenser in a fixed spatial relationship with, and spaced from, the VC, the condenser has a mounting arm extending from a side of the condenser;
• and
• a mounting bracket coupling the condenser with the base, the mounting bracket has a horizontally-oriented plate and a vertically-oriented plate that each define one or more oblong holes, wherein the horizontally-oriented plate is secured to the base via one or more vertically-oriented fasteners that extend through respective ones of the one or more oblong holes of the horizontally-oriented plate, and wherein the vertically-oriented plate is secured to the mounting arm via one or more horizontally-oriented fasteners that extend through respective ones of the one or more oblong holes of the vertically-oriented plate so that the condenser is oriented and positioned at a height that holds the VC on the TIM in a neutral position.