# US 12,765,377 B2 · Circuit board

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- Number: US 12,765,377 B2
- Document ID: US12765377B2
- Status: Granted
- Kind: B2
- Application number: 18/455,066
- Filed: 2023-08-24
- Published: 2025-01-30
- Granted: 2026-10-13
- Earliest claimed: 2023-07-24
- Assignees: Qingding Precision Electronics (Huai'an) Co., Ltd.; Avary Holding (Shenzhen) Co., Limited.; Garuda Technology Co., Ltd.
- Applicants: QingDing Precision Electronics (Huai'an) Co., Ltd.; Avary Holding (Shenzhen) Co., Ltd.; Garuda Technology Co., Ltd.
- Inventors: Hao Wang
- Web page: https://patentgrep.com/patent/US12765377B2

## CPC

- H10W 40/28: comprising Peltier coolers
- H10N 19/00: Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
- H10W 72/073: {of die-attach connectors}
- H10W 72/075: {of bond wires}
- H10W 72/354: {comprising polymers}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 90/732: {between stacked chips}
- H10W 90/752: {between stacked chips}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

## Abstract

A circuit board includes a main board, a thermistor layer, a plurality of n-type semiconductor units and a plurality of p-type semiconductor units. The main board includes a first external structure, a second external structure, and an internal structure disposed between the first external structure and the second external structure. The internal structure includes a first internal circuit layer, a second internal circuit layer, and an insulating layer disposed between the first internal circuit layer and the second internal circuit layer. The thermistor layer is disposed on the insulating layer and the first internal circuit layer. The n-type semiconductor units and the p-type semiconductor units are electrically connected to the second internal circuit layer and the second external structure, in which the n-type semiconductor units and the p-type semiconductor units are alternately arranged in one direction.

## Claims

### Claim 1

A circuit board, comprising:
a main board, comprising:
a first external structure;
a second external structure; and
an internal structure disposed between the first external structure and the second external structure, wherein the internal structure, the first external structure, and the second external structure are stacked along a first direction,
wherein the internal structure includes:
a first internal circuit layer;
a second internal circuit layer; and
an insulating layer disposed between the first internal circuit layer and the second internal circuit layer, wherein the insulating layer, the first internal circuit layer, and the second internal circuit layer are stacked along the first direction;
a first bonding layer disposed between the internal structure and the first external structure, wherein the first bonding layer connects to the internal structure and the first external structure;
a second bonding layer disposed between the internal structure and the second external structure, wherein the second bonding layer connects to the internal structure and the second external structure;
a thermistor layer embedded in the first bonding layer and disposed on the insulating layer and the first internal circuit layer, wherein the thermistor layer directly contacts the insulating layer;
a plurality of N-type semiconductor units and a plurality of P-type semiconductor units, wherein the N-type semiconductor units and the P-type semiconductor units are embedded in the second bonding layer and electrically connect to the second internal circuit layer and the second external structure, wherein the N-type semiconductor units and the P-type semiconductor units alternately arrange along a second direction perpendicular to the first direction, and an orthogonal projection of the N-type semiconductor units and the P-type semiconductor units on the insulating layer overlaps an orthogonal projection of the thermistor layer on the insulating layer;
a first thermal conductive layer disposed on the thermistor layer; and
a second thermal conductive layer disposed on the second external structure,
wherein the second thermal conductive layer directly contacts the second external structure and the second bonding layer.

### Claim 2 (depends on 1)

The circuit board of claim 1, wherein the second internal circuit layer comprises a plurality of cold ends, and the second external structure comprises a plurality of hot ends, wherein an ith N-type semiconductor unit is adjacent to an ith P-type semiconductor unit, the ith N-type semiconductor unit and the ith P-type semiconductor unit connect to a same cold end, and the ith P-type semiconductor unit and a (i+1)th N-type semiconductor unit connect to a same hot end, where i is a positive integer.

### Claim 3 (depends on 1)

The circuit board of claim 1, wherein the N-type semiconductor units and the P-type semiconductor units electrically connect to the second external structure.

### Claim 4 (depends on 3)

The circuit board of claim 3, further comprising:
a dissipation reinforcing layer disposed on the second thermal conductive layer.

### Claim 5 (depends on 1)

The circuit board of claim 1, further comprising:
an image sensor disposed on the first thermal conductive layer.

### Claim 6 (depends on 1)

The circuit board of claim 1, wherein a protruding portion of the internal structure protrudes from a sidewall of the first external structure and a sidewall of the second external structure, wherein the main board further comprising:
a first cover layer covering the protruding portion of the internal structure; and
a second cover layer covering the protruding portion of the internal structure;
wherein the circuit board further comprising:
an extending board, wherein the extending board electrically connects to the protruding portion of the internal structure.

### Claim 7 (depends on 6)

The circuit board of claim 6, wherein the extending board comprises a data processor and a driving circuit.

### Claim 8 (depends on 1)

The circuit board of claim 1, further comprising:
a solder mask layer disposed on the first external structure and on the second external structure.

### Claim 9 (depends on 1)

The circuit board of claim 1, further comprising:
a protecting layer on the first external structure, wherein the protecting layer includes a nickel-gold layer.