Semiconductor package with heat-dissipation interface
AssigneePanjit International Inc.
InventorsChung-Hsiung Ho, Chien-Chun Wang, Wei-Ting Chen, Wei-Ting Chen
Life of this patent
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Abstract
A semiconductor package with a heat dissipation interface has a substrate, at least one die embedded in the substrate, an insulation layer encompassing the die and covering the substrate, an upper redistribution layer (RDL) and a lower RDL respectively formed on opposite sides of the substrate, wherein an insulated adhesive comprehensively covers the lower RDL, and a dissipation layer is further bonded on the insulated adhesive. The dissipation layer evenly dissipates excessive heat energy generated by the die, thereby improving the heat dissipation efficiency.
Claims11
A semiconductor package with a heat dissipation interface comprising:
- a substrate having a die mounting hole and a conductive hole;
- a die, placed in the die mounting hole, having a first surface and a second surface opposite to each other, and having at least one signal pad on each of the first surface and the second surface respectively;
- an insulation layer filling the die mounting hole and encompassing the die, covering the substrate and exposing the at least one signal pad on the first surface of the die and the conductive hole;
- an upper redistribution layer (RDL) formed on the insulation layer and for connecting the at least one signal pad on the first surface of the die and the conductive hole, wherein the at least one signal pad on the first surface of the die is not electrically connected to the conductive hole;
- a lower redistribution layer (RDL) formed on the substrate and opposite to the upper RDL for electrically connecting the at least one signal pad on the second surface of the die to the conductive hole;
- an insulated adhesive comprehensively covering the lower RDL;
- and
- a dissipation layer attached to the insulated adhesive without electrically connecting to the upper RDL and the lower RDL.
Dependencies are inferred from the claim text.