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US 12,765,373 B2Granted
Semiconductor package device and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsShiu-Fang Yen, Chang-Lin Yeh, Jen-Chieh Kao
Life of this patent
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Abstract
A semiconductor package device includes a substrate, an electronic component, and a thermal conductive layer. The electronic component is disposed on the substrate and includes a first surface facing away from the substrate. The thermal conductive layer is disposed above the first surface of the electronic component. The thermal conductive layer includes a plurality of portions spaced apart from each other.
Claims16
A semiconductor package device, comprising:
- a substrate;
- a die, wherein the die has an active surface on which a signal passes through and an inactive surface on which no signal passes through;
- a plurality of first thermal conductive layers attached to the inactive surface of the die and spaced apart from each other;
- a plurality of second thermal conductive layers attached to corresponding first thermal conductive layers, wherein a material of the plurality of second thermal conductive layers is different from that of the plurality of first thermal conductive layers;
- and
- a plurality of connection elements disposed under the substrate and surrounding the plurality of second thermal conductive layers.
3 more elements
A semiconductor package device, comprising:
- a circuit board comprising a pad attached to an active surface of the circuit board;
- a die disposed over the circuit board;
- a plurality of connection elements disposed over the circuit board and functioning as a signal transmission region to the circuit board;
- and
- a conductive layer disposed under the die and functioning as a non-signal transmission region between the die and the circuit board, wherein the conductive layer is in contact with a lateral surface of the pad.
2 more elements
A semiconductor package device, comprising:
- a die having an inactive surface on which no signal passes through;
- a plurality of metal layers on the inactive surface of the die and spaced apart from each other;
- a plurality of solder layers on corresponding metal layers;
- and
- an encapsulant encapsulating the plurality of metal layers, wherein the plurality of solder layers are free of being laterally covered by the encapsulant.
2 more elements
Dependencies are inferred from the claim text.