Method for manufacturing embedded and packaged heat dissipation structure

A method for manufacturing an embedded and packaged heat dissipation structure, comprising:

• a) forming a semi-finished plate, wherein the semi-finished plate comprises an embedded device and a first metal layer, and wherein the first metal layer is attached to a non-pin surface of the embedded device;
• b) forming a heat dissipation plate based on the first metal layer, wherein the heat dissipation plate is attached to the non-pin surface of the embedded device;
• c) manufacturing a heat dissipation copper column on the heat dissipation plate;
• d) providing a dielectric layer, wherein the dielectric layer covers the heat dissipation copper column;
• e) laminating a second metal layer on the dielectric layer;
• f) partially etching the second metal layer and the dielectric layer to form a microchannel, wherein the heat dissipation copper column and the heat dissipation plate are arranged in the microchannel, and both an outlet and an inlet of the microchannel are arranged on a side surface of the semi-finished plate perpendicular to a direction of the semi-finished plate;
• g) removing a remaining part of the second metal layer;
• and
• h) laminating a sealing layer on the dielectric layer to seal the microchannel in a direction perpendicular to the semi-finished plate to obtain the embedded and packaged heat dissipation structure.