Molded package and power module with temperature sense cavity
AssigneeInfineon Technologies AG
InventorsThorsten Scharf, Michael Fügl
Life of this patent
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Abstract
A molded package includes: a mold compound; a first power semiconductor die encapsulated by the mold compound; and a first temperature sense cavity formed in a surface of the mold compound. The molded package is devoid of temperature sense terminals. The first temperature sense cavity is dimensioned to receive a temperature sensor and/or a combined area of each sidewall and a bottom of the first temperature sense cavity is greater than an area of an opening in the surface of the mold compound that delineates the first temperature sense cavity. A corresponding power module and a power electronics assembly that includes the molded package or the power module are also described.
Claims20
A molded package, comprising:
- a mold compound;
- a first power semiconductor die encapsulated by the mold compound;
- and
- a first temperature sense cavity formed in a surface of the mold compound,
- wherein the molded package is devoid of temperature sense terminals,
- wherein the first temperature sense cavity is dimensioned to receive a temperature sensor and/or a combined area of each sidewall and a bottom of the first temperature sense cavity is greater than an area of an opening in the surface of the mold compound that delineates the first temperature sense cavity.
A power module, comprising:
- an electrically insulative frame;
- a lid;
- a first power semiconductor die attached to a substrate and enclosed by the electrically insulative frame, the lid and the substrate;
- and
- an opening in the lid,
- wherein the opening in the lid is dimensioned to receive a temperature sensor.
A power electronics system, comprising:
- a circuit board;
- a molded package mounted to the circuit board;
- and
- a temperature sensor,
- wherein the molded package comprises:
- a mold compound;
- a first power semiconductor die encapsulated by the mold compound;
- and
- a first temperature sense cavity formed in a surface of the mold compound,
- wherein the molded package is devoid of temperature sense terminals,
- wherein the first temperature sense cavity is dimensioned to receive the temperature sensor and/or a combined area of each sidewall and a bottom of the first temperature sense cavity is greater than an area of an opening in the surface of the mold compound that delineates the first temperature sense cavity.
Dependencies are inferred from the claim text.